運輸箱與載具
單晶圓和多晶圓運輸容器，具有防靜電保護和潔淨室級包裝。
概述
Wafer shipping is a critical link in the semiconductor supply chain — a perfectly manufactured wafer that arrives with particle contamination, mechanical damage, or ESD degradation represents complete value destruction. Whether you are shipping prime wafers between fabs, sending out for foundry processing, or delivering finished wafers to OSAT packaging houses, the shipping container is your last and most important line of defense.
GINECHIP provides a comprehensive line of wafer shipping boxes and carriers engineered for international logistics: single-wafer shippers with precision-machined foam cushioning for high-value SOI or patterned wafers, multi-wafer shippers capable of transporting full 25-wafer cassettes, vacuum-sealed containers with optional nitrogen backfill for oxidation-sensitive materials, and ESD-safe Faraday cage designs for advanced CMOS devices with sub-2nm gate oxides.
運輸箱類型
單片晶圓運輸盒
為最高價值的晶圓精密打造——SOI、圖案化晶圓、光罩級空白基板及特殊基板。
- Individually cushioned — zero wafer-to-wafer contact
- Available with vacuum port for hermetic sealing
- Optional nitrogen backfill for oxidation-sensitive wafers
- Shock indicator and tilt indicator labels available
多片晶圓運輸盒
經濟高效的解決方案，透過導電泡棉隔板與卡匣式內盒設計運送多片晶圓（2-25片）。
- 2, 6, 13, or 25 wafer capacities
- Conductive PE foam separators between each wafer
- Cassette-in-box design for compatibility with fab automation
- Stackable for efficient pallet loading
真空密封晶圓運輸容器
配備真空閥的氣密密封容器，適用於濕度敏感及易氧化材料。
- Leak rate: < 1×10⁻⁶ atm·cc/sec (He)
- Humidity indicator card included (standard)
- Desiccant pack integrated into lid
- Suitable for GaAs, InP, and other III-V substrates
扣殼式晶圓載具
輕量鉸鏈式扣殼載具，適用於高頻取用場景，具備快速開合鎖扣。
- Single-action latch for gloved operation
- Clear PC lid for visual wafer inspection without opening
- Lightweight: 50% less than aluminum alternatives
- Stackable with interlocking base/lid design
技術規格
| Parameter | Available Range / Values |
|---|---|
| Type | Single-wafer shipper, Multi-wafer shipper (25/13 wafer), Clamshell, Vacuum-sealed, Foam-lined |
| Wafer Diameter | 100mm (4″), 150mm (6″), 200mm (8″), 300mm (12″) |
| Capacity | 1 wafer, 2–6 wafers, 13 wafers, 25 wafers (standard cassette), custom |
| Body Material | Conductive PP, Antistatic PC, ABS, PEEK, PTFE, Aluminum (anodized) |
| Cushion Material | Conductive PE foam, Antistatic PU foam, PTFE inserts, PEEK wafer separators |
| ESD Protection | Static-dissipative: 10⁴–10⁹ Ω/sq; Conductive: < 10⁴ Ω/sq; Faraday cage designs |
| Seal Type | Hermetic vacuum seal, O-ring gasket, Latch-lock, Tamper-evident tape, Nitrogen backfill port |
| Cleanroom Class | ISO Class 4–5 (Class 10–100) cleanroom assembled and packaged |
| Standards | SEMI E154, ISTA 3A, ASTM D4169, UN 4G/4H packaging (dangerous goods option) |
| Temperature Range | Standard: -20°C to +80°C; Premium PEEK: -40°C to +260°C |
| Customization | Custom foam inserts, company logo, barcode labels, RFID tag slots, color coding |
ESD保護與包裝完整性
Static Protection Levels
- Static-Dissipative — 10⁶–10⁹ Ω/sq surface resistivity for controlled charge bleed-off; suitable for most device technologies
- Conductive — < 10⁴ Ω/sq for rapid charge dissipation; required for devices with ESD sensitivity below 100V HBM
- Faraday Cage — Full metal or metalized enclosure providing complete electrostatic shielding; equivalent to MIL-PRF-81705 Type III
- Buried Shielding Layer — Metalized inner liner with dissipative outer shell; combines Faraday cage effectiveness with external ESD safety
Mechanical Protection
- Shock Absorption — Conductive PE/PU foam with 25–50G deceleration at 1m drop height per ISTA 3A
- Vibration Damping — Foam compliance tuned for 5–500Hz transport vibration spectrum
- Crush Resistance — Reinforced corners and ribbed body structure for stacking loads up to 100kg
- Impact Indicators — G-force shock indicators (25G, 50G, 75G thresholds) and tilt indicators for logistics quality assurance
國際運輸合規
ISTA 3A
Packaging performance testing simulating parcel delivery and LTL freight environments. Our shippers pass drop, vibration, and atmospheric conditioning tests as defined in ISTA 3A for packages up to 70kg.
ASTM D4169
Standard practice for performance testing of shipping containers and systems. Covers handling, compression, vibration, and low-pressure (altitude) testing — all validated for our shipping box designs.
UN 4G / 4H
UN-certified fiberboard (4G) and plastic (4H) packaging for regulated materials. Available for wafers that require dangerous goods classification (e.g., certain III-V substrates with specific chemical treatments).
應用
品質與認證
Every shipping box is assembled and packaged in an ISO Class 5 (Class 100) cleanroom environment. Quality assurance includes particle count verification per IEST-RP-CC005, ESD performance testing per ANSI/ESD STM11.11, outgassing analysis per ASTM E595 (where specified), and drop testing per ISTA 3A on each design revision. ISO 9001:2015 certified quality management with full lot traceability from raw material to final shipment.