Laser Marking & Re-ID

Laser · Scribe · Data MatrixMarking Types

SEMI T7 · M12 · M13Standards

1–50μmMark Depth Range

Si · GaAs · SiC · GlassSubstrate Types

Overview

Every wafer in a semiconductor fab carries a unique laser-engraved identification mark — the fundamental unit of fab traceability. When a wafer's ID is lost through backgrinding, polishing, reclaim, or processing, that wafer loses its history and becomes untrackable. Similarly, when reclaimed wafers are re-introduced into production, they need a new ID while preserving their original history.

GINECHIP provides a complete laser marking and wafer identification service: SEMI-standard laser scribing for new and in-process wafers, soft shallow marking for device-side identification on patterned wafers, wafer re-identification (Re-ID) with cross-referenced lot history for reclaimed wafers, automated serialization for lot and wafer-level traceability, material-specific marking for compound semiconductors and specialty substrates, and mark removal for repurposed wafers.

Services

Laser Scribe & ID Marking

Permanent laser marking of alphanumeric wafer IDs, 2D data matrix codes, and OCR-readable scribe characters on wafer frontside or backside. Compliant with SEMI T7 (backside) and SEMI M12/M13 standards for wafer identification and traceability. Laser scribe depths and profiles optimized for wafer material and thickness to avoid device damage.

Mark: Alphanumeric, Data Matrix, SEMI fontLocation: frontside or backsideDepth: 5–50μm (Si), controlledReadable: OCR + machine visionStandards: SEMI T7, M12, M13Wafer: 100mm–300mm

Soft Marking (Shallow Dot Matrix)

Ultra-shallow laser dot-matrix marking (1–5μm depth) for device-side wafer identification where deep scribing could impact device yield through stress or contamination. Optimized for patterned wafers with device exclusion zones — marks placed exclusively in scribe line areas between die.

Depth: 1–5μm (shallow profile)Dot matrix formatDevice-side compatibleScribe-line placementMinimal debris: extraction systemIdeal for post-pattern wafers

Wafer Re-Identification (Re-ID)

Re-marking service for wafers that have lost their original laser identification — due to backgrinding, polishing, reclaim processing, or oxidation. Application of a new, traceable ID while maintaining a cross-reference log to the original ID for full lot history continuity. Essential for reclaimed and reprocessed wafers.

New ID applied to reclaimed wafersCross-reference to original ID maintainedCompatible with thin wafersFrontside or backside optionsFull lot history traceablePhoto documentation provided

Laser Serialization & Traceability

High-speed automated laser serialization of full wafer lots with unique, sequential IDs for lot-level and wafer-level traceability. 2D data matrix codes encode lot number, wafer number, product code, and date. Compatible with fab MES (Manufacturing Execution System) and wafer tracking systems.

Sequential serialization2D Data Matrix per SEMI T7Encoded: lot, wafer#, product, dateOCR verification post-markMES integration readyThroughput: up to 100 wph

Laser Marking on Non-Silicon

Laser marking adapted for compound semiconductors and specialty substrates: GaAs (lower power to avoid arsenic release), SiC (UV laser for hard material), glass and quartz (CO₂ for micro-crack marking), sapphire, and ceramic substrates. Parameters optimized per material to achieve clear, readable marks without substrate damage.

GaAs, InP: low-power markingSiC: UV (355nm) laserGlass: CO₂ or UV laserTCO-coated: non-penetrative markCeramic (Al₂O₃, AlN): standardThin wafer: shallow profile

Mark Removal & Cleanup

Controlled removal of existing laser marks — required when wafers are re-purposed, reclaimed, or reassigned to a different product. Chemical-mechanical mark removal with surface reconditioning to match surrounding wafer surface. Verification that mark residue and sub-surface damage are fully eliminated.

Chemical-mechanical removalSurface reconditioning post-removalVerification: no residual markAFM: no sub-surface cracksCompatible with all wafer typesPhoto documentation before/after

SEMI Standards Compliance

Our laser marking complies with the key SEMI wafer identification standards: SEMI T7 — Specification for back surface marking of wafers with alphanumeric and Data Matrix codes; SEMI M12 — Alphanumeric mark specification defining font, character size, and spacing; SEMI M13 — Alphanumeric marking of wafers defining mark format and content. Post-mark OCR and machine vision verification is performed on 100% of wafers, with read-rate typically exceeding 99.9%.

Re-ID Process for Reclaimed Wafers

When a wafer is reclaimed (stripped, polished, reconditioned), its original laser mark is typically removed or diminished. Our Re-ID process: (1) inspect and photo-document the current wafer surface and any remnant ID, (2) apply new laser mark with a new unique ID in the standard location, (3) record cross-reference in our lot history database linking the new ID to the original wafer ID and reclaim batch, (4) OCR-verify the new mark readability, and (5) deliver photo documentation and cross-reference certificate with the wafer lot. This ensures complete traceability continuity even through multiple reclaim cycles.

Need Wafer Marking or Re-Identification?

Specify your wafer type, marking location, ID format, and quantity — our team will provide a quotation within 24 hours.

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ISO 9001:2015OCR VerifiedSEMI CompliantPhoto Documented