基板
MEMS 製程
晶圓再生
配件耗材
應用領域 & 資源
商店 關於我們
寬禁帶平台技術
SiC / GaN材料
100mm–200mm產能
ISO 9001:2015認證

概述

寬禁帶半導體(SiC和GaN)正在徹底改變電力電子產業。GINECHIP提供高品質的SiC和GaN基板,支援從電動車牽引逆變器到數據中心電源的各種高壓、高頻應用。我們的基板經過嚴格的品質篩選,確保最低的缺陷密度和最高的可靠性。

我們提供業界領先的品質和精度,所有寬禁帶基板均附帶完整的材料認證和追溯資訊。

SiC器件

powerElectronicsSicGan.sic1Name

powerElectronicsSicGan.sic1Desc

Voltage: 650V, 1200V, 1700V, 3.3kVRDS(on): 15–80 mΩ (1200V)Tj(max): 175–200°CGate: planar or trenchBody diode: low Vf, fast recoveryDiameters: 100mm, 150mm

powerElectronicsSicGan.sic2Name

powerElectronicsSicGan.sic2Desc

Voltage: 650V, 1200V, 1700VCurrent: 2A–50A+ (per die)Qrr: near-zeroVf: 1.5V (typical @ rated I)Surge: 10× rated (MPS structure)JBS or MPS architectures

powerElectronicsSicGan.sic3Name

powerElectronicsSicGan.sic3Desc

Power: 10kW–300kW+Topology: half-bridge, 6-packBaseplate: AlSiC, CuSubstrate: AlN DBC, Si₃N₄ AMBCooling: liquid or forced airGate driver integration support

GaN器件

powerElectronicsSicGan.gan1Name

powerElectronicsSicGan.gan1Desc

Voltage: 100V, 650VRDS(on): 15–200 mΩQg: 1–10 nC (extremely low)Switching: >1 MHz capableGate: p-GaN e-modeWafer: 200mm Si (111)

powerElectronicsSicGan.gan2Name

powerElectronicsSicGan.gan2Desc

Voltage: 1.2kV–10kV (R&D)Substrate: semi-insulating 4H-SiCVertical or lateral CAVETCurrent: 1–50A (development)Thermal: 4.9 W/cm·K (SiC)Diameter: 100mm, 150mm

powerElectronicsSicGan.gan3Name

powerElectronicsSicGan.gan3Desc

Integration: FET + driver + protectionTopology: half-bridge, full-bridgeSwitching: up to 10 MHzVoltage: 48V–650VProtection: OCP, OTP, UVLOPackage: WLCSP, QFN

材料比較

屬性SiSiCGaN
powerElectronicsSicGan.paramBandgap1.123.263.39
powerElectronicsSicGan.paramCriticalField0.32.83.3
powerElectronicsSicGan.paramElectronMobility1,4001,0001,250 (bulk) / 2,000 (2DEG)
powerElectronicsSicGan.paramThermalConductivity1.54.91.3 (bulk) / 4.9 (on SiC)
powerElectronicsSicGan.paramBaligaFOM1340870
powerElectronicsSicGan.paramMaxJunctionTemp150–175200–250200–250
powerElectronicsSicGan.paramWaferDiameter200mm, 300mm150mm, 200mm200mm (on Si)

所有規格均基於標準產品。客製化規格可根據需求提供。

應用領域

powerElectronicsSicGan.app1Title

powerElectronicsSicGan.app1Desc

powerElectronicsSicGan.app2Title

powerElectronicsSicGan.app2Desc

powerElectronicsSicGan.app3Title

powerElectronicsSicGan.app3Desc

powerElectronicsSicGan.app4Title

powerElectronicsSicGan.app4Desc

powerElectronicsSicGan.app5Title

powerElectronicsSicGan.app5Desc

powerElectronicsSicGan.app6Title

powerElectronicsSicGan.app6Desc

基板品質

我們的功率電子級基板具有卓越的表面品質,顆粒數< 5(0.2μm)、TTV < 2μm、表面粗糙度< 0.2nm RMS。這些規格對於低缺陷密度的外延生長和高良率的器件製造至關重要。

所有基板均經過嚴格的進料檢驗,包括AFM表面粗糙度量測、光譜橢偏儀薄膜厚度驗證和雷射顆粒掃描。每批貨物均附帶合格證書。

可靠性

環境可靠性測試包括溫度循環、HAST、高溫儲存和機械衝擊,均按照MIL-STD和JEDEC標準進行。鍵合晶圓對針對您應用特定的環境條件進行了驗證。

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ISO 9001 認證 寬禁帶材料 Epi-Ready 表面 24小時回覆