TTV / 彎曲 / 翹曲量測

±0.2μm (k=2)Stat Ttv Accuracy

TTV · Bow · WarpStat Geometry Params

≥ 2,500 ptsStat Dense Grid

SEMI MF1390/1451/1530Stat Standards Compliant

概述

一個全面的能力和服務概述。

我們提供業界領先的品質和精度。

Sec Measurement Services

ttvBowWarpMeasurement.geometrySvc1Name

ttvBowWarpMeasurement.geometrySvc1Desc

Capacitance gauge: 0.01μm resolution≥ 2,500 points per 300mm waferTTV reported: max-min (μm)Global metric, full waferSEMI MF1530 compliantNIST-traceable calibration

ttvBowWarpMeasurement.geometrySvc2Name

ttvBowWarpMeasurement.geometrySvc2Desc

Free-state measurement (no chuck)Optical profilometry / laser scanBow: warp in free statePositive (convex) or negative (concave)Resolution: 0.1μmSEMI MF1390 / MF1451 compliant

ttvBowWarpMeasurement.geometrySvc3Name

ttvBowWarpMeasurement.geometrySvc3Desc

Free-state measurementBest-fit plane referencePeak-to-valley: entire waferCaptures all shape deviationsResolution: 0.1μmSEMI MF1390 / MF1451 compliant

ttvBowWarpMeasurement.geometrySvc4Name

ttvBowWarpMeasurement.geometrySvc4Desc

Flatness = thickness variation (chucked)Shape = curvature (free state)Both must be specified for processIndependent measurement methodsComplementary quality metricsCritical for thin wafer handling

Sec Process Flow

ttvBowWarpMeasurement.flowStep1

ttvBowWarpMeasurement.flowStep1Desc

ttvBowWarpMeasurement.flowStep2

ttvBowWarpMeasurement.flowStep2Desc

ttvBowWarpMeasurement.flowStep3

ttvBowWarpMeasurement.flowStep3Desc

ttvBowWarpMeasurement.flowStep4

ttvBowWarpMeasurement.flowStep4Desc

ttvBowWarpMeasurement.flowStep5

ttvBowWarpMeasurement.flowStep5Desc

ttvBowWarpMeasurement.flowStep6

ttvBowWarpMeasurement.flowStep6Desc

Sec Quality Specs

參數	目標規格	量測方法
TTV Accuracy	± 0.2μm (k=2)	NIST-traceable thickness standards
TTV Repeatability	± 0.1μm (3σ)	Repeat measurements (30 cycles)
Bow Measurement Accuracy	± 1.0μm (k=2)	NIST-traceable optical flat reference
Warp Measurement Accuracy	± 1.5μm (k=2)	NIST-traceable optical flat reference
Bow/Warp Repeatability	± 0.5μm (3σ)	Repeat measurements on standard wafer
Measurement Speed (300mm)	TTV: 30 sec; Bow/Warp: 60 sec	Cycle time measurement
Environmental Control	23 ± 0.5°C; 45 ± 5% RH	NIST-traceable sensors, continuous log
Data Export Format	CSV, PDF report, SPC data package	LIMS data export module

Table Note

Sec Measurement Methods

Cap Gauge Title

Cap Gauge Description

Optical Profilometry Title

Optical Profilometry Description

Sec Shape Vs Flatness

Shape Vs Flatness Paragraph

Sec Thin Wafer

Thin Wafer Paragraph

Sec Data Output

Data Output Intro

Pdf Report Title

Pdf Report Description

Csv Export Title

Csv Export Description

應用

App Incoming QCTitle

App Incoming QCDesc

AQL sampling or 100% Supplier-independent verification Shipping damage detection NIST-traceable data

Sec Quality Assurance

Qa Paragraph

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