基板 · 材料
玻璃基板
用於MEMS、微流體和晶圓級光學的精密玻璃晶圓 — 熔融石英、硼矽酸鹽、石英、無鹼玻璃。
Fused Silica · Borosilicate · Quartz材料選項
100mm–300mm直徑範圍
> 90% Transmission紫外至近紅外
RMS < 0.5nmCMP表面處理
概述
玻璃基板在MEMS、微流體、光學和生物醫學領域具有廣泛的應用。GINECHIP提供全面的玻璃和石英晶圓基板，包括硼矽酸鹽玻璃、熔融石英、藍寶石和單晶石英等多種材料選擇。
我們提供業界領先的品質和精度，所有玻璃基板均在無塵室環境中包裝和運輸。
材料類型
熔融石英（紫外級）
高純度合成熔融石英，具有卓越的紫外線穿透率和極低的熱膨脹係數，是光學、光刻和半導體應用的理想選擇。
- Transmission: 185nm–2.1μm with > 90% T
- Extremely low autofluorescence
- High laser damage threshold
- Available in JGS1 (UV), JGS2, JGS3 grades
- CMP-finished to sub-nanometer RMS
Borofloat 33
Borofloat 33 是一種硼矽酸鹽玻璃晶圓，具有優異的抗熱衝擊性和化學耐久性。廣泛用於MEMS、微流體和光學應用。
- CTE: 3.25 ppm/K — matched to silicon
- Transformation temp: 525°C
- High chemical resistance (hydrolytic class 1)
- Available DSP with excellent flatness
- Suitable for through-glass via (TGV) processing
AF 32® eco
SCHOTT AF 32® eco 是一種無鹼薄玻璃，具有出色的熱穩定性和化學耐久性，適用於MEMS和生物醫學應用。
- CTE: 3.2 ppm/K — silicon-matched
- Low dielectric loss: tan δ ~ 0.004 at 10 GHz
- Available as thin as 100μm
- Excellent for TGV interposers in 2.5D packaging
- No alkali migration issues for TFT backplanes
D 263® T eco
SCHOTT D 263® T eco 是一種薄硼矽酸鹽玻璃，具有高透光率和優異的表面品質，適用於光學和顯示器應用。
- Available in thicknesses from 30μm–1100μm
- High transmission from 350nm–2.5μm
- Refractive index n = 1.5230
- Smooth fire-polished surface
- Cost-effective for high-volume applications
單晶石英
單晶石英晶圓具有精確的晶體取向和優異的壓電特性，適用於高頻振盪器、濾波器和感測器應用。
- Piezoelectric coefficient d₁₁ = 2.31 pC/N
- AT-cut for temperature-stable resonators
- High Q-factor for low phase noise oscillators
- Available from 2″ to 4″ wafers
- Custom crystallographic orientations
鈉鈣浮法玻璃
經濟實惠的鈉鈣玻璃晶圓，適用於研究、教育和低成本的微流體應用。提供多種尺寸和厚度選擇。
- Soda-lime: lowest cost, widely available
- Aluminosilicate: high scratch resistance
- Custom glass compositions supported
- Thin (< 100μm) and ultra-thin available
- Prototyping and small-batch friendly
技術規格
| 參數 | 可用範圍 / 值 |
|---|---|
| Materials | Fused Silica (SiO₂), Borosilicate Glass (Borofloat® 33, AF32® eco, D263®), Quartz (single-crystal), Soda-Lime, Alkali-Free Glass |
| Diameter | 100mm (4″), 150mm (6″), 200mm (8″), 300mm (12″) |
| Thickness | 100μm–1100μm (ultra-thin 50μm available for flexible substrates) |
| Surface Quality | DSP, SSP, CMP-finished; S/D 40/20 or better per MIL-PRF-13830B |
| Surface Roughness | RMS < 0.5nm (CMP), < 1.0nm standard polish |
| TTV / Bow / Warp | TTV < 3μm, Bow < 20μm (fused silica); custom specifications available |
| CTE | 0.55 ppm/K (fused silica), 3.2 ppm/K (AF32), 7.2 ppm/K (D263), 3.25 ppm/K (Borofloat) |
| Transmission | > 90% from 185nm–2.1μm (fused silica); D263: > 90% from 350nm–2.5μm |
| Refractive Index (n₅₈₉) | Fused Silica: 1.458; Borosilicate: 1.471–1.473; D263: 1.523; AF32: 1.510 |
| Dielectric Constant | 3.8 (fused silica), 4.6 (borosilicate), 5.1–6.9 (alkali-free glass) at 1 MHz |
| Packaging | Interleaved with cleanroom paper, single-wafer cassette, vacuum-sealed outer bag |
應用
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TGV技術
玻璃穿孔（TGV）技術實現了高密度垂直互連，適用於3D封裝和RF應用。我們的TGV基板具有優異的電氣隔離性能和低介電損耗。