Wafer Frames & Rings
Complete wafer handling consumables — metal and plastic frames, grip rings, dicing tape, cassettes, and protective films. Your wafer is only as secure as the frame that holds it.
Overview
Wafer handling consumables — frames, rings, tapes, and cassettes — are the often-overlooked backbone of semiconductor back-end processing. A perfectly fabricated wafer can be destroyed in seconds by a warped frame, inadequate tape adhesion, or a contaminated cassette. GINECHIP supplies the complete range of wafer mounting and handling consumables to keep your dicing, die bonding, backgrinding, and wafer transport operations running reliably.
Our product line covers every step of back-end wafer handling: metal and plastic wafer frames for dicing tape mounting, dicing tape and UV-release films for clean die singulation, backgrinding tape for wafer thinning protection, thin-wafer support frames for fragile substrate handling, and SEMI-standard cassettes and carriers for clean, safe wafer transport and storage.
Product Range
Metal Wafer Frames (K&S / ESEC Standard)
Stainless steel or aluminum wafer frames compatible with industry-standard dicing tape mounting systems. Available for all wafer diameters with SEMI-standard dimensions. Designed for use with dicing tape laminators, wafer mounters, and die bonder frame handlers. Frame thickness and flatness optimized for stable wafer support during dicing and pick-and-place operations.
Plastic Wafer Frames (Grip Ring)
Lightweight, low-cost plastic grip rings for wafer mounting on dicing tape. Popular in high-volume packaging environments due to lower cost, reduced weight for automated handling, and no metal contamination risk. Available in anti-static (ESD-safe) grades for sensitive device handling.
Thin-Wafer Support Frames
Specialized frames for handling ultra-thin wafers (< 100μm) during backside processing, dicing, and die pick-and-place. Includes support rings, carrier plates, and vacuum-compatible designs that prevent wafer warpage and breakage during thin-wafer handling.
Wafer Cassettes & Carriers
SEMI-standard wafer cassettes and carriers for wafer transport, storage, and process tool loading. Available in PFA (high-temperature, chemical resistant), polypropylene (standard), and anti-static materials. Compatible with automated wafer handling systems (SMIF, FOUP).
Dicing Tape & Films
UV-curable and non-UV dicing tapes for wafer mounting prior to blade dicing or laser dicing. UV tapes reduce adhesion after UV exposure for gentle die pick-up; non-UV tapes provide consistent adhesion throughout the dicing process. Available with various adhesive strengths for different wafer thicknesses and die sizes.
Backgrinding Tape & Protective Films
Protective tapes and films applied to the wafer frontside during backgrinding to prevent device surface damage and contamination. Available in various thicknesses and adhesion levels for different wafer topographies (flat passivation, bump topography, MEMS structures).
Common Applications
Metal and plastic frames with dicing tape for blade dicing, laser dicing, and stealth dicing. Compatible with DISCO, ADT, and ESEC dicing saw frame handling systems.
UV-curable tape frames for automated die pick-and-place after dicing. UV exposure reduces tape adhesion for gentle, low-stress die ejection — critical for thin and fragile die.
Frontside protection tape and backgrinding tape for wafer thinning processes. Protects device structures during mechanical grinding and chemical-mechanical polishing (CMP).
SEMI-standard cassettes for interbay and intrabay wafer transport. FOUP and SMIF pod compatible designs for automated material handling systems in 200mm and 300mm fabs.
Support frames and carrier systems for handling wafers thinned below 100μm. Critical for 3D-IC stacking, TSV reveal, and advanced packaging processes requiring ultra-thin die.
Small-quantity frame and tape supplies for university labs and pilot production lines. No minimum order — single frames to full-box quantities available.
Frame & Tape Selection Guide
Choosing the right combination of frame, tape, and handling protocol is critical for dicing yield and die-pick efficiency. Key selection criteria include: wafer thickness (standard > 200μm vs ultra-thin < 100μm requires different tape adhesion and frame support), die size (small die < 1mm² require higher tape adhesion to prevent die fly during dicing; large die > 10mm² benefit from UV-release tape for easier pick-up), dicing method (blade dicing generates lateral forces requiring higher tape adhesion; laser/stealth dicing is gentler), and backside metallization (solder-wettable backside metals may require tape with specific chemical compatibility).
Our application engineers are available to recommend the optimal frame and tape combination for your specific dicing and assembly process — contact us with your wafer and process details.
Quality & Cleanliness
All wafer handling consumables are manufactured and packaged to semiconductor cleanroom standards: particle-controlled (< 100 particles per frame/cassette at 0.5μm), outgassing tested (per ASTM E595 for space/satellite applications), ESD-safe options (surface resistivity 10⁶–10⁹ Ω/sq for static-sensitive devices), and packaged in cleanroom-compatible materials with lot traceability. Certificate of Conformance available upon request.
Need Wafer Frames or Tapes?
Specify your wafer diameter, process type (dicing, backgrinding, mounting), and frame/tape preferences — our team will recommend the right products and provide a quotation within 24 hours.