Транспортировочные коробки и носители
Контейнеры для транспортировки одной и нескольких пластин.
Обзор
Wafer shipping is a critical link in the semiconductor supply chain — a perfectly manufactured wafer that arrives with particle contamination, mechanical damage, or ESD degradation represents complete value destruction. Whether you are shipping prime wafers between fabs, sending out for foundry processing, or delivering finished wafers to OSAT packaging houses, the shipping container is your last and most important line of defense.
GINECHIP provides a comprehensive line of wafer shipping boxes and carriers engineered for international logistics: single-wafer shippers with precision-machined foam cushioning for high-value SOI or patterned wafers, multi-wafer shippers capable of transporting full 25-wafer cassettes, vacuum-sealed containers with optional nitrogen backfill for oxidation-sensitive materials, and ESD-safe Faraday cage designs for advanced CMOS devices with sub-2nm gate oxides.
Типы транспортировочных коробок
Single-Wafer Shipper
Precision-engineered for the most valuable wafers — SOI, patterned wafers, reticle-grade blanks, and exotic substrates. Each wafer is individually suspended in CNC-machined conductive foam with controlled compression for shock isolation.
- Individually cushioned — zero wafer-to-wafer contact
- Available with vacuum port for hermetic sealing
- Optional nitrogen backfill for oxidation-sensitive wafers
- Shock indicator and tilt indicator labels available
Multi-Wafer Shipper
Cost-efficient solution for shipping multiple wafers (2–25). Wafers are separated by antistatic interleaf foam sheets or seated in individual slots within a conductive cassette insert. Ideal for test-grade and monitor wafers.
- 2, 6, 13, or 25 wafer capacities
- Conductive PE foam separators between each wafer
- Cassette-in-box design for compatibility with fab automation
- Stackable for efficient pallet loading
Vacuum-Sealed Shipper
Hermetically sealed container with vacuum port for moisture-sensitive and oxidation-prone materials. Achieves < 10 ppm moisture levels with appropriate desiccant. Can be backfilled with nitrogen or argon for inert atmosphere transport.
- Leak rate: < 1×10⁻⁶ atm·cc/sec (He)
- Humidity indicator card included (standard)
- Desiccant pack integrated into lid
- Suitable for GaAs, InP, and other III-V substrates
Clamshell & Quick-Access
Lightweight, hinged clamshell carriers for frequent-access scenarios — metrology lab transfers, short-distance fab-to-fab moves, and R&D sample exchange. Fast open/close with secure latch mechanism.
- Single-action latch for gloved operation
- Clear PC lid for visual wafer inspection without opening
- Lightweight: 50% less than aluminum alternatives
- Stackable with interlocking base/lid design
Технические характеристики
| Parameter | Available Range / Values |
|---|---|
| Type | Single-wafer shipper, Multi-wafer shipper (25/13 wafer), Clamshell, Vacuum-sealed, Foam-lined |
| Wafer Diameter | 100mm (4″), 150mm (6″), 200mm (8″), 300mm (12″) |
| Capacity | 1 wafer, 2–6 wafers, 13 wafers, 25 wafers (standard cassette), custom |
| Body Material | Conductive PP, Antistatic PC, ABS, PEEK, PTFE, Aluminum (anodized) |
| Cushion Material | Conductive PE foam, Antistatic PU foam, PTFE inserts, PEEK wafer separators |
| ESD Protection | Static-dissipative: 10⁴–10⁹ Ω/sq; Conductive: < 10⁴ Ω/sq; Faraday cage designs |
| Seal Type | Hermetic vacuum seal, O-ring gasket, Latch-lock, Tamper-evident tape, Nitrogen backfill port |
| Cleanroom Class | ISO Class 4–5 (Class 10–100) cleanroom assembled and packaged |
| Standards | SEMI E154, ISTA 3A, ASTM D4169, UN 4G/4H packaging (dangerous goods option) |
| Temperature Range | Standard: -20°C to +80°C; Premium PEEK: -40°C to +260°C |
| Customization | Custom foam inserts, company logo, barcode labels, RFID tag slots, color coding |
ESD-защита и целостность упаковки
Static Protection Levels
- Static-Dissipative — 10⁶–10⁹ Ω/sq surface resistivity for controlled charge bleed-off; suitable for most device technologies
- Conductive — < 10⁴ Ω/sq for rapid charge dissipation; required for devices with ESD sensitivity below 100V HBM
- Faraday Cage — Full metal or metalized enclosure providing complete electrostatic shielding; equivalent to MIL-PRF-81705 Type III
- Buried Shielding Layer — Metalized inner liner with dissipative outer shell; combines Faraday cage effectiveness with external ESD safety
Mechanical Protection
- Shock Absorption — Conductive PE/PU foam with 25–50G deceleration at 1m drop height per ISTA 3A
- Vibration Damping — Foam compliance tuned for 5–500Hz transport vibration spectrum
- Crush Resistance — Reinforced corners and ribbed body structure for stacking loads up to 100kg
- Impact Indicators — G-force shock indicators (25G, 50G, 75G thresholds) and tilt indicators for logistics quality assurance
Соответствие международным перевозкам
ISTA 3A
Packaging performance testing simulating parcel delivery and LTL freight environments. Our shippers pass drop, vibration, and atmospheric conditioning tests as defined in ISTA 3A for packages up to 70kg.
ASTM D4169
Standard practice for performance testing of shipping containers and systems. Covers handling, compression, vibration, and low-pressure (altitude) testing — all validated for our shipping box designs.
UN 4G / 4H
UN-certified fiberboard (4G) and plastic (4H) packaging for regulated materials. Available for wafers that require dangerous goods classification (e.g., certain III-V substrates with specific chemical treatments).
Применения
Качество и сертификация
Every shipping box is assembled and packaged in an ISO Class 5 (Class 100) cleanroom environment. Quality assurance includes particle count verification per IEST-RP-CC005, ESD performance testing per ANSI/ESD STM11.11, outgassing analysis per ASTM E595 (where specified), and drop testing per ISTA 3A on each design revision. ISO 9001:2015 certified quality management with full lot traceability from raw material to final shipment.
Нужны решения для транспортировки?
Укажите размер, количество, способ доставки. Ответ в течение 24 ч.