배송 상자 및 캐리어
정전기 방지 보호 기능과 클린룸 등급 포장을 갖춘 단일 및 다중 웨이퍼 선적 컨테이너입니다.
개요
Wafer shipping is a critical link in the semiconductor supply chain — a perfectly manufactured wafer that arrives with particle contamination, mechanical damage, or ESD degradation represents complete value destruction. Whether you are shipping prime wafers between fabs, sending out for foundry processing, or delivering finished wafers to OSAT packaging houses, the shipping container is your last and most important line of defense.
GINECHIP provides a comprehensive line of wafer shipping boxes and carriers engineered for international logistics: single-wafer shippers with precision-machined foam cushioning for high-value SOI or patterned wafers, multi-wafer shippers capable of transporting full 25-wafer cassettes, vacuum-sealed containers with optional nitrogen backfill for oxidation-sensitive materials, and ESD-safe Faraday cage designs for advanced CMOS devices with sub-2nm gate oxides.
배송 상자 유형
단일 웨이퍼 배송 상자
SOI, 패턴 웨이퍼, 레티클 등급 블랭크 및 특수 기판 등 가장 가치 있는 웨이퍼를 위해 정밀하게 설계되었습니다.
- Individually cushioned — zero wafer-to-wafer contact
- Available with vacuum port for hermetic sealing
- Optional nitrogen backfill for oxidation-sensitive wafers
- Shock indicator and tilt indicator labels available
다중 웨이퍼 배송 상자
전도성 폼 분리기와 카세트 인 박스 설계를 통해 여러 개의 웨이퍼(2~25개)를 운송하기 위한 비용 효율적인 솔루션입니다.
- 2, 6, 13, or 25 wafer capacities
- Conductive PE foam separators between each wafer
- Cassette-in-box design for compatibility with fab automation
- Stackable for efficient pallet loading
진공 밀봉된 웨이퍼 운송업체
습기에 민감하고 산화되기 쉬운 재료를 위한 진공 포트가 있는 밀봉된 용기입니다.
- Leak rate: < 1×10⁻⁶ atm·cc/sec (He)
- Humidity indicator card included (standard)
- Desiccant pack integrated into lid
- Suitable for GaAs, InP, and other III-V substrates
클램셸 웨이퍼 캐리어
빠른 열기/닫기 래치 기능을 갖춘 빈번한 액세스 시나리오를 위한 경량의 힌지형 클램셸 캐리어입니다.
- Single-action latch for gloved operation
- Clear PC lid for visual wafer inspection without opening
- Lightweight: 50% less than aluminum alternatives
- Stackable with interlocking base/lid design
기술 사양
| Parameter | Available Range / Values |
|---|---|
| Type | Single-wafer shipper, Multi-wafer shipper (25/13 wafer), Clamshell, Vacuum-sealed, Foam-lined |
| Wafer Diameter | 100mm (4″), 150mm (6″), 200mm (8″), 300mm (12″) |
| Capacity | 1 wafer, 2–6 wafers, 13 wafers, 25 wafers (standard cassette), custom |
| Body Material | Conductive PP, Antistatic PC, ABS, PEEK, PTFE, Aluminum (anodized) |
| Cushion Material | Conductive PE foam, Antistatic PU foam, PTFE inserts, PEEK wafer separators |
| ESD Protection | Static-dissipative: 10⁴–10⁹ Ω/sq; Conductive: < 10⁴ Ω/sq; Faraday cage designs |
| Seal Type | Hermetic vacuum seal, O-ring gasket, Latch-lock, Tamper-evident tape, Nitrogen backfill port |
| Cleanroom Class | ISO Class 4–5 (Class 10–100) cleanroom assembled and packaged |
| Standards | SEMI E154, ISTA 3A, ASTM D4169, UN 4G/4H packaging (dangerous goods option) |
| Temperature Range | Standard: -20°C to +80°C; Premium PEEK: -40°C to +260°C |
| Customization | Custom foam inserts, company logo, barcode labels, RFID tag slots, color coding |
ESD 보호 및 포장 무결성
Static Protection Levels
- Static-Dissipative — 10⁶–10⁹ Ω/sq surface resistivity for controlled charge bleed-off; suitable for most device technologies
- Conductive — < 10⁴ Ω/sq for rapid charge dissipation; required for devices with ESD sensitivity below 100V HBM
- Faraday Cage — Full metal or metalized enclosure providing complete electrostatic shielding; equivalent to MIL-PRF-81705 Type III
- Buried Shielding Layer — Metalized inner liner with dissipative outer shell; combines Faraday cage effectiveness with external ESD safety
Mechanical Protection
- Shock Absorption — Conductive PE/PU foam with 25–50G deceleration at 1m drop height per ISTA 3A
- Vibration Damping — Foam compliance tuned for 5–500Hz transport vibration spectrum
- Crush Resistance — Reinforced corners and ribbed body structure for stacking loads up to 100kg
- Impact Indicators — G-force shock indicators (25G, 50G, 75G thresholds) and tilt indicators for logistics quality assurance
국제 배송 규정 준수
ISTA 3A
Packaging performance testing simulating parcel delivery and LTL freight environments. Our shippers pass drop, vibration, and atmospheric conditioning tests as defined in ISTA 3A for packages up to 70kg.
ASTM D4169
Standard practice for performance testing of shipping containers and systems. Covers handling, compression, vibration, and low-pressure (altitude) testing — all validated for our shipping box designs.
UN 4G / 4H
UN-certified fiberboard (4G) and plastic (4H) packaging for regulated materials. Available for wafers that require dangerous goods classification (e.g., certain III-V substrates with specific chemical treatments).
응용
품질 및 인증
Every shipping box is assembled and packaged in an ISO Class 5 (Class 100) cleanroom environment. Quality assurance includes particle count verification per IEST-RP-CC005, ESD performance testing per ANSI/ESD STM11.11, outgassing analysis per ASTM E595 (where specified), and drop testing per ISTA 3A on each design revision. ISO 9001:2015 certified quality management with full lot traceability from raw material to final shipment.