Precision Wafer Substrates & Process Services
From silicon to compound semiconductors — engineered for your exact process requirements. Global supply chain partner for fabs, MEMS foundries, and research institutions.
Our Products
Featured Substrates
High-purity semiconductor substrates engineered for your process requirements.
Process Services
End-to-End MEMS & Semiconductor Processing
Complete fab services from deposition to dicing.
Thin-Film Deposition
PVD, CVD, ALD processes for oxide, nitride, metal and dielectric films on 200mm and 300mm wafers.
Photolithography
Contact, proximity, and projection lithography down to 0.5µm resolution with full mask design support.
Wafer Bumping & UBM
Solder bumps, Cu pillars, Au studs with full UBM stack — SnAg, SAC, AuSn metallurgies supported.
Wafer Reclaim
Chemical-mechanical stripping and re-polishing of used test wafers to virgin-grade surface quality.
Industry Solutions
Industries We Serve
Tailored wafer solutions across the semiconductor value chain.
MEMS & Sensors
Pressure sensors, accelerometers, gyroscopes, microphones — substrates and process services for MEMS foundries.
Learn More →RF & Power Devices
GaAs, GaN-on-SiC, SOI substrates for RF front-end modules, power amplifiers, and mmWave devices.
Learn More →Photonics & LiDAR
Silicon photonics, VCSEL arrays, waveguide substrates, and LiDAR emitter/receiver wafers.
Learn More →Power Electronics
SiC and GaN epi-ready substrates for high-voltage power MOSFETs, Schottky diodes, and HEMTs.
Learn More →Advanced Packaging
RDL bump wafers, interposers, TSV substrates for 2.5D/3D heterogeneous integration and chiplets.
Learn More →R&D & Academia
Small-batch prototyping wafers, custom specifications, and flexible supply for university and corporate labs.
Learn More →Knowledge Base
Latest Technical Articles
In-depth technical insights, industry trends, and product application notes.
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Ready to discuss your wafer requirements?
Our engineering team will respond with a detailed quotation within 24 hours.