Wafer Resizing — Diameter Reduction & Edge Profiling | GINECHIP

100mm–300mmStat Diam Range

50μm–725μmStat Thickness Range

TTV < 1μmStat Thickness Acc

SEMI M1 StandardStat Edge Profiles

Overview

A comprehensive overview of our capabilities and services.

We deliver industry-leading quality and precision.

Resizing Services

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Reduction: 200→150, 200→100, 150→100Other conversions by requestEdge: SEMI standard profileEdge chipping: < 0.3mmConcentricity: < 50μmWafer: Si, SOI, glass, ceramic

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Primary flat: SEMI M1 standardNotch: SEMI M1 standardOrientation accuracy: < 1°Length/depth per standardPost-machining edge polishWafer: Si, GaAs, InP, SiC

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Profiles: T, R, K (SEMI M1)Custom profiles by requestEdge polish: mechanical + CMPEdge roughness: Ra < 0.5μmMicro-crack eliminationPost-process edge inspection

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Method: grinding, lapping, CMPTarget: 50μm–725μmTTV: < 1μm (post-CMP)Bow/warp: within specificationStress relief etch optionalWafer: Si, SOI, glass, SiC

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Split: 1 wafer → multiple smallerCircular or rectangular formatsDicing or cleaving optionsEdge quality: minimal chippingCustom sizes: drawing-basedMaterial: Si, SOI, glass

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Method: XRD rocking curveAccuracy: < 0.1°Marking: new flat/notch or laserSi, GaAs, InP, SiC, sapphireReport: orientation confirmedPost-ID: laser mark if needed

Edge Quality Control

Post-resize edge quality is verified by edge profile microscopy and surface roughness measurement. Edge chipping is maintained below SEMI specifications, and the edge profile is customized to match your equipment requirements for smooth handling.

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