Wafer diameter reduction and shape conversion — round-to-square, edge profiling, and thickness reduction.

100mm–300mmDiameter Range

50μm–725μmThickness Range

TTV < 1μmThickness Accuracy

SEMI M1 StandardEdge Profiles

Overview

Wafer resizing services convert wafers from one diameter to another, helping fabs and equipment makers adapt to different process tool requirements. GINECHIP provides precision wafer resizing supporting sizes from fragments up to 300mm.

We deliver industry-leading quality and precision, ensuring every resized wafer meets all applicable SEMI standards.

Resizing Services

Diameter Reduction

Precision turning and edge grinding to convert wafers between standard diameters (e.g., 200→150mm, 200→100mm), producing a SEMI-compliant edge profile with minimal chipping.

Reduction: 200→150, 200→100, 150→100Other conversions by requestEdge: SEMI standard profileEdge chipping: < 0.3mmConcentricity: < 50μmWafer: Si, SOI, glass, ceramic

Flat & Notch Machining

Primary flat or notch machining to SEMI M1 orientation standards, with crystallographic accuracy within 1° and a polished post-machining edge.

Primary flat: SEMI M1 standardNotch: SEMI M1 standardOrientation accuracy: < 1°Length/depth per standardPost-machining edge polishWafer: Si, GaAs, InP, SiC

Edge Profiling

Mechanical grinding and CMP finishing to SEMI M1 T, R, or K edge profiles, eliminating micro-cracks and achieving sub-0.5μm edge roughness.

Profiles: T, R, K (SEMI M1)Custom profiles by requestEdge polish: mechanical + CMPEdge roughness: Ra < 0.5μmMicro-crack eliminationPost-process edge inspection

Thickness Reduction

Grinding, lapping, and CMP thinning to target thicknesses from 725μm down to 50μm, holding post-CMP TTV below 1μm with optional stress-relief etch.

Method: grinding, lapping, CMPTarget: 50μm–725μmTTV: < 1μm (post-CMP)Bow/warp: within specificationStress relief etch optionalWafer: Si, SOI, glass, SiC

Wafer Splitting

Precision dicing or cleaving to split a single wafer into multiple smaller circular or rectangular formats, per drawing-based custom dimensions.

Split: 1 wafer → multiple smallerCircular or rectangular formatsDicing or cleaving optionsEdge quality: minimal chippingCustom sizes: drawing-basedMaterial: Si, SOI, glass

Orientation Verification & Re-ID

XRD rocking-curve measurement confirms crystal orientation to within 0.1°, with new flat, notch, or laser marking applied as needed.

Method: XRD rocking curveAccuracy: < 0.1°Marking: new flat/notch or laserSi, GaAs, InP, SiC, sapphireReport: orientation confirmedPost-ID: laser mark if needed

Edge Quality Control

Post-resize edge quality is verified by edge profile microscopy and surface roughness measurement. Edge chipping is maintained below SEMI specifications, and the edge profile is customized to match your equipment requirements for smooth handling.

Ready to Get Started?

Contact our engineering team to discuss your specific requirements and receive a detailed quotation within 24 hours.

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ISO 9001 CertifiedSEMI T7 CompliantEdge InspectionXRD Analysis

Wafer Resizing