Laser Marking & Re-ID — SEMI Standard Wafer Identification | GINECHIP

Laser · Scribe · Data MatrixMark Types

SEMI T7 · M12 · M13Compliance Standards

1–50μmMark Depth Range

Si · GaAs · SiC · GlassSubstrate Types

Overview

Laser marking and re-identification are critical steps in wafer tracking and supply chain management. GINECHIP provides SEMI-standard soft mark and hard mark laser services supporting OCR, 2D matrix (Data Matrix ECC200), QR codes, and custom identification patterns — ensuring complete traceability of every wafer throughout its lifecycle.

We deliver industry-leading quality and precision with all marks compliant to SEMI T7, SEMI M1, and SEMI M12/M13 standards — compatible with wafers up to 300mm diameter.

Marking Services

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Mark: Alphanumeric, Data Matrix, SEMI fontLocation: frontside or backsideDepth: 5–50μm (Si), controlledReadable: OCR + machine visionStandards: SEMI T7, M12, M13Wafer: 100mm–300mm

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Depth: 1–5μm (shallow profile)Dot matrix formatDevice-side compatibleScribe-line placementMinimal debris: extraction systemIdeal for post-pattern wafers

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New ID applied to reclaimed wafersCross-reference to original ID maintainedCompatible with thin wafersFrontside or backside optionsFull lot history traceablePhoto documentation provided

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Sequential serialization2D Data Matrix per SEMI T7Encoded: lot, wafer#, product, dateOCR verification post-markMES integration readyThroughput: up to 100 wph

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GaAs, InP: low-power markingSiC: UV (355nm) laserGlass: CO₂ or UV laserTCO-coated: non-penetrative markCeramic (Al₂O₃, AlN): standardThin wafer: shallow profile

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Chemical-mechanical removalSurface reconditioning post-removalVerification: no residual markAFM: no sub-surface cracksCompatible with all wafer typesPhoto documentation before/after

SEMI Standard Compliance

All laser marks comply with SEMI T7, SEMI M1, and SEMI M12/M13 standards. Marks include alphanumeric characters, Data Matrix (ECC200), QR codes, and custom symbologies. Hard marks (20–80μm depth) and soft marks (5–20μm depth) are available depending on wafer reuse requirements.

Re-Identification Process

Our re-identification process follows a systematic workflow: laser ablation of previous marks, surface cleaning and preparation, new mark engraving, mark verification via automated optical inspection, and final certification. Each wafer is tracked through the entire process.

Ready to Get Started?

Contact our engineering team to discuss your specific requirements and receive a detailed quotation within 24 hours.

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ISO 9001 CertifiedOCR Readable MarksSEMI T7 CompliantPhoto Documentation

Laser Marking Re-ID