Glass Substrates
Precision glass wafers for MEMS, microfluidics, and wafer-level optics — fused silica, borosilicate, quartz, and alkali-free glass.
Overview
Glass substrates serve a broad range of applications across MEMS, microfluidics, optics, and biomedical devices. GINECHIP offers a comprehensive range of glass and quartz wafer substrates, including borosilicate glass, fused silica, sapphire, and single crystal quartz among other material options.
We deliver industry-leading quality and precision — every glass substrate is packaged and shipped in a cleanroom environment.
Material Types
Fused Silica (UV-Grade)
High-purity synthetic fused silica with exceptional UV transmission (down to 185nm), ultra-low thermal expansion (CTE 0.55 × 10⁻⁶/K), and superior laser damage threshold. Ideal for photomask substrates, optical windows, and precision optics. Available 100mm–300mm.
- Transmission: 185nm–2.1μm with > 90% T
- Extremely low autofluorescence
- High laser damage threshold
- Available in JGS1 (UV), JGS2, JGS3 grades
- CMP-finished to sub-nanometer RMS
Borofloat® 33
Borofloat® 33 is a borosilicate glass wafer with excellent thermal shock resistance (CTE 3.25 × 10⁻⁶/K), high chemical durability, and exceptional flatness. Widely used for anodic bonding with silicon and microfluidic device fabrication. Available in 100mm–200mm diameters.
- CTE: 3.25 ppm/K — matched to silicon
- Transformation temp: 525°C
- High chemical resistance (hydrolytic class 1)
- Available DSP with excellent flatness
- Suitable for through-glass via (TGV) processing
AF 32® eco
SCHOTT AF 32® eco is an alkali-free thin glass with excellent thermal stability and chemical durability, suited for MEMS and biomedical applications.
- CTE: 3.2 ppm/K — silicon-matched
- Low dielectric loss: tan δ ~ 0.004 at 10 GHz
- Available as thin as 100μm
- Excellent for TGV interposers in 2.5D packaging
- No alkali migration issues for TFT backplanes
D 263® T eco
SCHOTT D 263® T eco is a thin borosilicate glass with high light transmission and excellent surface quality, suited for optical and display applications.
- Available in thicknesses from 30μm–1100μm
- High transmission from 350nm–2.5μm
- Refractive index n = 1.5230
- Smooth fire-polished surface
- Cost-effective for high-volume applications
Single-Crystal Quartz
Single crystal quartz wafers with precise crystallographic orientation, excellent piezoelectric properties, and high Q-factor for RF resonator and SAW filter applications. Available with AT-cut, ST-cut, and custom orientations. Diameters from 100mm to 150mm.
- Piezoelectric coefficient d₁₁ = 2.31 pC/N
- AT-cut for temperature-stable resonators
- High Q-factor for low phase noise oscillators
- Available from 2″ to 4″ wafers
- Custom crystallographic orientations
Soda Lime Float Glass
Economical soda lime glass wafers for research, prototyping, and non-critical applications. Good optical clarity and surface quality. Ideal for microfluidic device development, wafer bonding test vehicles, and educational use. Standard 100mm–150mm diameters.
- Soda-lime: lowest cost, widely available
- Aluminosilicate: high scratch resistance
- Custom glass compositions supported
- Thin (< 100μm) and ultra-thin available
- Prototyping and small-batch friendly
Technical Specifications
| Parameter | Available Range / Values |
|---|---|
| Materials | Fused Silica (SiO₂), Borosilicate Glass (Borofloat® 33, AF32® eco, D263®), Quartz (single-crystal), Soda-Lime, Alkali-Free Glass |
| Diameter | 100mm (4″), 150mm (6″), 200mm (8″), 300mm (12″) |
| Thickness | 100μm–1100μm (ultra-thin 50μm available for flexible substrates) |
| Surface Quality | DSP, SSP, CMP-finished; S/D 40/20 or better per MIL-PRF-13830B |
| Surface Roughness | RMS < 0.5nm (CMP), < 1.0nm standard polish |
| TTV / Bow / Warp | TTV < 3μm, Bow < 20μm (fused silica); custom specifications available |
| CTE | 0.55 ppm/K (fused silica), 3.2 ppm/K (AF32), 7.2 ppm/K (D263), 3.25 ppm/K (Borofloat) |
| Transmission | > 90% from 185nm–2.1μm (fused silica); D263: > 90% from 350nm–2.5μm |
| Refractive Index (n₅₈₉) | Fused Silica: 1.458; Borosilicate: 1.471–1.473; D263: 1.523; AF32: 1.510 |
| Dielectric Constant | 3.8 (fused silica), 4.6 (borosilicate), 5.1–6.9 (alkali-free glass) at 1 MHz |
| Packaging | Interleaved with cleanroom paper, single-wafer cassette, vacuum-sealed outer bag |
Applications
MEMS & Microfluidic Devices
Anodic-bonded glass caps and channels for pressure sensors, accelerometers, and lab-on-chip microfluidic systems built on Borofloat and AF32 substrates.
Wafer-Level Optics & Photomask Blanks
Fused silica substrates polished to sub-nanometer roughness for photomask blanks, optical windows, and UV-transparent lenses.
Anodic & Fusion Wafer Bonding
CTE-matched borosilicate glass bonded directly to silicon for hermetic MEMS packaging and cavity SOI-equivalent structures.
2.5D/3D Glass Interposers (TGV)
Through-glass via processing on AF32 and fused silica substrates enables low-loss RF interposers for advanced packaging.
RF Resonators & SAW/BAW Filters
Single-crystal quartz wafers cut AT or ST orientation for high-Q piezoelectric resonators and surface acoustic wave filter fabrication.
Display & Touch Panel Substrates
Soda-lime and D263 glass substrates for TFT backplanes, touch sensor stacks, and cover glass in display manufacturing.
TGV Technology
Through-Glass Via technology enables high-density vertical interconnects through glass substrates for 2.5D and 3D packaging. Glass TGVs offer superior RF performance (low dielectric loss at mmWave), smooth sidewalls, and compatibility with panel-level processing. Via diameters from 20μm to 200μm with aspect ratios up to 10:1.
Ready to Get Started?
Contact our engineering team to discuss your specific requirements and receive a detailed quotation within 24 hours.