Glass Substrates
Fused silica, borosilicate, quartz, and specialty glass wafers for MEMS, microfluidics, wafer-level optics, and bio-sensing applications.
Overview
Glass substrates serve a critical role in semiconductor fabrication beyond the traditional silicon platform — enabling wafer-level optics, microfluidic devices, anodic bonding to silicon, and display backplanes. GINECHIP provides a complete range of precision glass wafers with tight thickness control, optical-grade polish, and compatibility with MEMS foundry processes.
Whether you need UV-grade fused silica for diffractive optics, CTE-matched borosilicate for silicon-glass bonding stacks, or alkali-free glass for high-resolution display manufacturing — our glass substrate supply chain meets SEMI specifications with full lot traceability.
Technical Specifications
| Parameter | Available Range / Values |
|---|---|
| Materials | Fused Silica (SiO₂), Borosilicate (Borofloat® 33, Pyrex®), Quartz, Soda-Lime, Alkali-Free (AF 32 eco, Eagle XG®) |
| Diameter | 100mm (4″), 150mm (6″), 200mm (8″), 300mm (12″) |
| Thickness | 300µm–1,100µm (standard); 100µm–200µm (ultra-thin); custom available |
| CTE (Thermal Expansion) | 0.55 ppm/K (fused silica) to 8.5 ppm/K (soda-lime). Si-matched CTE options (3–4 ppm/K). |
| Surface Roughness | Ra < 0.5nm (polished); Ra < 5nm (as-drawn float glass) |
| Polish | SSP, DSP, CMP-finished, as-drawn/float |
| TTV / Bow | < 5µm TTV, < 10µm Bow (polished grades) |
| Transparency | UV-grade (>90% @ 193nm), Visible, IR-grade |
Glass Types & Properties
Fused Silica (SiO₂)
Ultra-low thermal expansion (0.55 ppm/K), high chemical durability, excellent UV-to-IR transmission. Ideal for high-temperature processes, photomask substrates, and precision optics. Available in UV-grade (>90% at 193nm) and standard grades.
Borosilicate (Borofloat® 33 / Pyrex®)
CTE ~3.25 ppm/K — closely matched to silicon, enabling low-stress anodic bonding. Excellent chemical resistance and thermal shock tolerance. The standard choice for MEMS packaging and microfluidic devices.
Quartz (Crystal SiO₂)
Crystalline form of SiO₂ with superior optical birefringence control, piezoelectric properties, and high-temperature stability. Used for SAW filters, oscillator blanks, and high-precision optical retarders.
Alkali-Free Display Glass
Eagle XG®, AF 32 eco, and similar compositions with CTE matched to silicon. Designed for LTPS and IGZO TFT backplanes in high-resolution OLED and LCD displays. Ultra-smooth as-drawn surface.
Applications
Borosilicate and fused silica for microfluidic channels, lab-on-chip, pressure sensor encapsulation, and MEMS packaging substrates.
Fused silica wafers for diffractive optical elements (DOEs), microlens arrays, and wafer-level camera modules. UV and IR transmission grades available.
Borosilicate (Pyrex®) for anodic bonding to silicon wafers. Fused silica for high-temperature fusion bonding in SOI and photonic applications.
Alkali-free glass for LTPS TFT backplanes in OLED displays. Ultra-thin glass for flexible and foldable display substrates.
Biocompatible glass substrates for DNA microarrays, cell culture chips, and implantable sensor packaging with hermetic sealing capability.
Low-autofluorescence quartz for integrated photonic circuits, planar lightwave circuits (PLC), and AWG-based wavelength multiplexers.
Bonding & Integration
Glass substrates are commonly integrated with silicon wafers via anodic bonding (borosilicate to Si, 300–500°C, 400–1000V), fusion bonding (SiO₂ to SiO₂, after surface activation and high-temp anneal), or adhesive bonding (using BCB, SU-8, or epoxy interlayers). We can recommend the optimal glass type and surface finish for your specific bonding process.
Quality Assurance
All glass wafers are inspected for thickness uniformity (TTV < 5µm), surface roughness (AFM measurement), particle count (laser surface scanner), and optical transmission (UV-Vis-NIR spectrophotometer). Each lot includes a full Certificate of Conformance.
Looking for Precision Glass Wafers?
Specify glass type, diameter, thickness, and surface finish — our team will provide technical recommendations and a competitive quotation within 24 hours.