Fused Silica Quartz Wafers
Three grades engineered for photomasks and DUV optics, with near-zero thermal expansion (CTE 0.55 × 10⁻⁶/K) and low-defect optical performance.
Overview
Fused silica is an amorphous SiO₂ material made from high-purity feedstock, offering extremely low thermal expansion (CTE 0.55 × 10⁻⁶/K), excellent deep-UV transmission, and very high chemical purity.
We supply UV-grade (JGS1), IR-grade (JGS3), and Synthetic fused silica. All wafers are available with RMS < 0.5nm standard / < 0.3nm precision, TTV ≤ 3µm, and Class 100 clean packaging.
<strong>Synthetic</strong> grade: 193nm transmission > 99.7%/cm—ideal for DUV photomask blanks and excimer-laser optics.
Grade Comparison
OH content and metal impurity levels determine deep-UV/IR transmission and laser tolerance. Select the grade best suited to your application.
UV-Grade (JGS1)
Best for UV optics & photomasks
High OH content and 185nm transmission above 90% make it ideal for UV optics and photomasks.
IR-Grade (JGS3)
Best for IR optics
Low OH content (<10ppm) enables >85% transmission at 2.7μm for IR optics and process chamber applications.
Synthetic Fused Silica
Best for DUV & excimer
With 193nm transmission above 99.7%/cm and metal impurities below 0.1ppm, it fits DUV lithography and excimer laser systems.
Optical Properties
Fused silica offers the widest transmission window of any glass—from deep UV (185nm) to near IR (2,500nm+)—with extremely low absorption, making it the standard choice for photomask blanks and excimer laser optics.
Deep UV
UV-grade fused silica delivers > 99.7%/cm internal transmission at 193nm with a high laser damage threshold for DUV lithography.
UV-Vis
Spectrally flat transmission across the visible range, n₅₈₉ = 1.4585, ideal for precision optics and metrology windows.
Near-IR
Low-OH synthetic grades maintain > 92% transmission at 1,550nm with minimal insertion loss for fiber-optic and IR sensor optics.
Processing Capabilities
Fused silica wafers are processed with the same double-side polishing, CMP, dicing and thinning flow used for semiconductor wafers, delivering substrate-level flatness and cleanliness.
Double-side polishing and CMP achieve TTV ≤ 3μm (optionally ≤ 1μm), bow ≤ 20μm and warp ≤ 25μm with RMS < 0.5nm (CMP < 0.3nm) surface roughness.
Laser and blade dicing produce smooth edges with low chipping and high yield for die-level singulation.
Thinning to 100μm–1,000μm with stress-relief processing ensures reliable handling through downstream bonding and assembly.
Photomask Substrates
Fused silica is the industry-standard photomask blank material; low thermal expansion (CTE 0.55 × 10⁻⁶/K) and high 193nm transmission make it the reference for DUV lithography.
Surface quality meets S/D 40/20 scratch-dig and low waviness on finished blanks, with metal contamination < 1ppm for defect control on advanced masks.
Specifications
| Parameter | Available Range / Values |
|---|---|
| Material Grade | UV-grade (JGS1), IR-grade (JGS3), Synthetic Fused Silica |
| Diameter | 100mm (4″), 150mm (6″), 200mm (8″), 300mm (12″) |
| Thickness | 200μm–1100μm, custom ±10μm tolerance |
| Surface Roughness | RMS < 0.5nm standard, < 0.3nm premium |
| TTV (Total Thickness Variation) | ≤ 3μm standard, ≤ 1μm premium |
| Bow / Warp | Bow ≤ 20μm, Warp ≤ 25μm |
| Transmission @ 185nm | > 90% UV-grade, > 85% standard |
| Refractive Index | n₅₈₉ = 1.4585 |
| CTE (Coefficient of Thermal Expansion) | 0.55 × 10⁻⁶/K (20–300°C), nearly zero thermal expansion |
| Dielectric Constant | 3.8 at 1 MHz |
| Softening Point | ~1,600°C (synthetic fused silica) |
| Density | 2.20 g/cm³ |
| Surface Quality | S/D 40/20 per MIL-PRF-13830B or better |
| Packaging | Class 100 cleanroom, interleaved, vacuum-sealed cassette or single-wafer shippers |
Typical Applications
Photomask Blanks
Low CTE 0.55 × 10⁻⁶/K and > 99.7%/cm transmission at 193nm for DUV photomask blanks.
Excimer Laser Optics
High laser damage threshold for 193nm and 248nm excimer optics in the deep UV.
Bio-MEMS & Microfluidics
Low autofluorescence and high chemical purity for fluorescence-based bioassays.
Fiber Optic Components
Low-OH grades with < 1ppm metal impurities for low-loss fiber coupling and precision ferrule substrates.
Capacitive MEMS
Dielectric constant 3.8 @ 1MHz with low dielectric loss for RF and sensor MEMS.
Precision Optics
Thermally stable, scratch-dig 40/20 substrates for mirrors, windows and interferometer components.
Metrology & Quality Control
Overview — every fused silica wafer is individually inspected and a full metrology report accompanies each shipment.
Request Your Fused Silica Wafer Quote
Send your custom specifications—grade (UV/IR/synthetic), diameter, thickness, and surface finish—and our engineering team will reply with a fast quote tailored to photomask, excimer optics, and precision optics applications.