IC / Die Boxes
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Overview
Once a wafer is diced, the resulting bare die enter one of the most delicate phases of the semiconductor supply chain. An individual die — sometimes smaller than a grain of sand — carries the full value of wafer fabrication, and its handling, storage, and transport directly impact assembly yield. GINECHIP supplies the full spectrum of die carriers and storage solutions trusted by OSAT providers, IDMs, and MEMS foundries worldwide.
Our die handling portfolio includes Gel-Pak adhesive carriers — the industry standard for secure, residue-free die immobilization — waffle packs with vacuum-release technology for automated die pick-and-place, JEDEC-standard matrix trays for high-volume assembly lines, and custom CNC-machined carriers for non-standard die geometries, MEMS devices with released structures, and optoelectronic chips with sensitive facet coatings.
Die Carrier Comparison
Gel-Pak (Adhesive Carrier)
Patented gel-based adhesive membrane that securely holds die in place through mechanical shock, vibration, and orientation changes. Die are released cleanly with zero adhesive residue — the gold standard for high-value and fragile die.
- Zero residue transfer to die surface (validated by FTIR and XPS)
- Three retention levels: standard, medium, high
- Vacuum-release box design for automated die ejection
- Temperature range: -55°C to +150°C (adhesive stable)
Waffle Pack (Vacuum-Release)
Precision-molded or machined cavity array with individual pockets for each die. Vacuum-release waffle packs allow automated die extraction via vacuum pickup tools. Industry standard for medium to high-volume die handling.
- 2″ × 2″ standard format; larger custom sizes
- 12–324 cavities per pack (die-size dependent)
- Conductive carbon-filled PS or PBT for ESD protection
- Stackable with interlocking lid for secure multi-pack transport
JEDEC Matrix Tray
Standardized JEDEC outline trays for automated assembly equipment — die bonders, pick-and-place machines, and automated optical inspection (AOI) systems. Pocket arrays are JEDEC Publication 95 registered outlines.
- JEDEC standard tray outlines: MO-153, MO-220, MO-277 and other registered designs
- 24–480 pockets per tray
- Compatible with all major die bonder brands (ASM, Besi, Shinkawa)
- Anti-static and conductive material options
Custom CNC-Machined Carrier
For non-standard die geometries, MEMS devices with released membranes or cantilevers, edge-emitting lasers with sensitive facets, and devices requiring specific orientation or standoff. Machined from solid ESD-safe material to your exact cavity dimensions.
- Custom cavity geometry from your die drawing or CAD file
- Materials: PEEK, Aluminum, PBT, PC, PTFE
- ±25μm cavity tolerance (standard); ±10μm on request
- Suitable for devices up to 50mm × 50mm
Technical Specifications
| Parameter | Available Range / Values |
|---|---|
| Carrier Type | Gel-Pak, Waffle Pack (vacuum-release), JEDEC Matrix Tray, Custom CNC-Machined Carrier, Tape & Reel |
| Material | Conductive PEEK, Antistatic PC, Conductive PS, Conductive PBT, Aluminum (anodized), Gel-Pak adhesive |
| Die Size Range | 0.1mm × 0.1mm to 50mm × 50mm (larger on request) |
| Cavity Count | Waffle pack: 12–324 cavities; JEDEC tray: 24–480 pockets; Gel-Pak: unlimited (continuous adhesive) |
| ESD Rating | Static-dissipative: 10⁵–10⁹ Ω/sq; Conductive: < 10⁴ Ω/sq; Gel-Pak: 10⁶–10⁸ Ω/sq (surface) |
| Cleanroom Class | ISO Class 4–5 (Class 10–100) assembled and double-bagged in cleanroom |
| Temperature Range | Standard: -20°C to +85°C; High-temp PEEK: -40°C to +260°C; Gel-Pak adhesive: -55°C to +150°C |
| Gel-Pak Retention | Standard retention, Medium retention, High retention — matched to die mass and surface roughness |
| Tray Dimensions | JEDEC-standard trays: 2″ (50.8mm) to 14″ (355.6mm); 2-pocket to 480-pocket matrix |
| Lid / Cover | Snap-fit transparent PC, Hinged, Screw-down ESD-safe, Vacuum-sealable lid, Gel-Pak vacuum-release box |
| Customization | Custom cavity geometry, laser engraving, color coding, RFID slots, anti-tamper seals |
Gel-Pak Selection & Handling Guide
Choosing Retention Level
- Low Retention (LR) — For large die (> 5mm²) with smooth backside. Minimal tack for easy pickup with low-ejection-force tools.
- Standard Retention (SR) — General purpose for die 1–25mm². Balanced tack for secure transport with standard vacuum pickup force.
- High Retention (HR) — For small die (< 1mm²), rough backside surfaces, or high-vibration transport. Maximum holding force while maintaining clean release.
- Ultra-High Retention (X-HR) — For extreme environments: aerospace vibration profiles, long-duration shipping, or die with very low mass (< 0.1mg)
Vacuum-Release Box System
- VR-Series Box — Apply vacuum to the Gel-Pak box to release die from the adhesive membrane. Compatible with automated die pick-and-place equipment.
- Manual Release — Tweezers or vacuum pencil pickup for low-volume laboratory use. Die peel off cleanly from Gel-Pak surface.
- Transfer Stations — Intermediate stations for transferring die between Gel-Pak and other carrier types (waffle pack, JEDEC tray, tape & reel)
- Double-Sided Gel-Pak — Die stored on both sides of a separator frame; doubles storage density in the same box footprint
Specialty Die-Handling Applications
MEMS Devices
Released MEMS structures (cantilevers, membranes, comb drives) require carriers that do not contact the active surface. Custom CNC carriers with standoff pockets and clearance zones prevent mechanical damage to fragile released microstructures.
Optoelectronic Chips
Edge-emitting lasers, photodetectors, and VCSEL arrays with sensitive facet coatings or anti-reflective surfaces. Carriers with facet-relief pockets and ESD-safe materials to prevent facet damage and electrostatic degradation.
GaN / SiC Power Die
Wide-bandgap power semiconductor die with vertical current flow and backside metallization. Conductive carriers maintain backside contact integrity; high-temperature PEEK carriers for die that have been through sinter or anneal steps.
Applications
Quality & Certification
All die carriers are manufactured and packaged under ISO 9001:2015 certified quality management. Gel-Pak products undergo adhesive residue testing via FTIR and XPS analysis, ESD performance validation per ANSI/ESD S20.20 and STM11.11, and particle counting per IEST-RP-CC005. Every lot is assembled and double-bagged in an ISO Class 5 cleanroom with full material traceability documentation.
Need Die Storage & Handling Solutions?
Tell us your die dimensions, quantity, handling requirements, and whether you need Gel-Pak or waffle pack — we'll recommend the optimal carrier and provide a quotation within 24 hours.