Wafer Frames Rings
Metal and plastic wafer frames, rings, and cassettes for wafer handling, transport, and storage.
Overview
Wafer frames and dicing tape are the foundational consumables of the semiconductor back-end — every die on every wafer passes through the dicing frame before reaching its final package. A frame with insufficient flatness causes die fly during sawing. Tape with wrong adhesion leaves adhesive residue or loses die during pickup. These are yield-killing failures that are entirely preventable with the right frame and tape specification.
GINECHIP supplies the complete wafer frame and dicing tape ecosystem for semiconductor assembly and packaging: stainless steel and aluminum metal frames for production dicing saws, plastic frames (PBT, PPS, PC) with ESD-safe options for high-throughput lines, thin-wafer support frames with vacuum compatibility for sub-100μm wafers, and a full range of UV and non-UV dicing tapes with controlled adhesion from 50 to 1500 gf/25mm.
Product Range
Looking for wafer cassettes and carriers? See our dedicated wafer cassettes page. Wafer Cassettes (PEEK, ESD-safe) →
Metal Wafer Frames (SS/Aluminum)
Precision stainless steel and aluminum wafer frames for production dicing saws. Compatible with K&S, ESEC, and DISCO equipment. Anodized or passivated surface finishes. Standard 100mm–300mm wafer sizes.
Learn morePlastic Wafer Frames (PBT/PPS/PC)
Lightweight plastic frames in PBT, PPS, and PC materials. ESD-safe conductive grades available. 50% weight reduction versus metal frames. Reusable or disposable options for high-throughput automated lines.
Learn moreThin-Wafer Support Frames
Specialized support frames for ultra-thin wafers below 100μm thickness. Vacuum-compatible designs with carrier plate options. Anti-warpage support with precision flatness below 20μm for 200mm and 300mm wafers.
Learn moreDicing Tape (UV & Non-UV)
UV-curable and non-UV dicing tapes on PVC, PO, and PET base films. Acrylic and synthetic rubber adhesives with controlled peel strength from 50 to 1500 gf/25mm. Thickness range 80–150μm for 100mm–300mm wafers.
Learn moreBackgrinding & Surface Protection Tape
Backgrinding protection tape and surface protection films. Residue-free removal after processing. Temperature resistance up to 200°C. Thickness 100–400μm with adhesion 100–1000 gf/25mm. For 100mm–300mm wafers.
Learn moreCommon Applications
Precision wafer dicing on DISCO, K&S, and ESEC saws. Frames provide stable tape tension for clean kerf and minimal chipping. Compatible with all major dicing saw brands and blade types.
Automated die ejection from dicing tape using ejector pin mechanisms. Frame flatness is critical for consistent pick height and reliable vacuum pickup. Optimized for high-speed assembly lines.
Thin wafer support frames and backgrinding tapes for wafer thinning to sub-100μm. Prevents wafer warpage and breakage during grinding and handling. Vacuum-compatible designs available.
Automated and manual tape mounting systems. Compatible with all major tape mounter brands. Clean, bubble-free application with controlled tape tension for optimal dicing performance.
UV-curable dicing tape reduces adhesion by 90%+ after UV exposure for low-stress die pickup. Critical for thin and fragile die. Standard 365nm UV wavelength compatibility.
Frames and cassettes for interbay/intrabay wafer transport. ESD-safe options for sensitive devices. SEMI standard configurations for compatibility with automated material handling systems.
Frame & Tape Selection Guide
Selecting the right dicing tape is a multi-variable optimization: wafer material, die size, dicing method, and downstream pick-and-place equipment all influence the ideal tape specification. GINECHIP offers tapes across the full parameter space: UV-curable (adhesion drops 90%+ after UV exposure for low-stress die pickup), non-UV (consistent adhesion throughout the process), and specialty formulations for challenging applications.
Key selection parameters: Adhesion level (50–1500 gf/25mm), base film material (PVC for general purpose, PO for low outgassing, PET for high temperature), tape thickness (80–150μm), and UV sensitivity (365nm standard). Our application engineers will help you match tape to your specific wafer type, die size, and assembly equipment.
Quality & Cleanliness
All frames and rings are cleaned and packaged in a controlled environment to prevent particle contamination during wafer mounting and dicing.
Need Frames or Dicing Tape?
Tell us your wafer size, thickness, and dicing equipment, and we'll recommend the right frame and tape combination for your process.