Substrates
MEMS Process
Reprocessing
Accessories
Resources
Technical Articles
Company
Shop
50mm – 200mm Diameter Range
IR Trans. 2–14μm IR Transmission
μₑ = 3900 cm²/V·s Electron Mobility
CZ / VGF Growth Growth Methods
Germanium wafers in stock — browse 50–200 mm diameters and doping options now.
Shop Germanium Wafers

Germanium Substrate Overview

Germanium (Ge) is a group IV semiconductor with an indirect bandgap of 0.66 eV and high electron mobility of 3,900 cm²/V·s, making it ideal for infrared optics and high-speed electronics.

Choose from N-type (Sb), P-type (Ga), or Intrinsic (undoped) grades with diameters of 50–200 mm, orientations (100), (111), and (110), and surface finishes from SSP/DSP to Epi-Ready with RMS <2Å.

5N+ purity, EPD < 5×10³/cm², and Epi-Ready surfaces for demanding IR and epitaxy applications.

Crystal Growth Methods

We grow germanium using Czochralski (CZ) and VGF techniques to support different requirements for crystal quality, diameter, and production efficiency.

Czochralski (CZ)

CZ growth is the standard for high-volume germanium production, delivering large-diameter ingots up to 200 mm with uniform doping and stable quality for optics and electronics.

VGF Growth

VGF (Vertical Gradient Freeze) offers lower dislocation density and improved homogeneity for specialty substrates used in epitaxy and high-performance applications.

Infrared Transmission

Germanium transmits over a broad 2–14 μm range with a refractive index of approximately 4.0, making it one of the most widely used materials for infrared optics.

High index and low dispersion enable compact lens designs for thermal imaging, FLIR systems, and CO₂ laser optics at 10.6 μm.

  • 2–14 μm transmission window covering MWIR and LWIR bands.
  • High index (n ≈ 4.0) enables compact, high-efficiency optical systems.
  • ~47% two-surface transmission, limited only by Fresnel reflection (uncoated).
  • AR coatings (including DLC) available for enhanced transmission and durability.

IR Transmission by Wavelength Band

Wavelength RangeTransmissionBand
2.0 – 3.0 μm ~47% (two-surface reflection limited) Mid-Wave Short
3.0 – 5.0 μm ~47% (intrinsic transparency) Mid-Wave Window
8.0 – 12.0 μm ~47% (intrinsic transparency) Long-Wave Window
10.6 μm ~47% (CO₂ laser line) CO₂ Laser Line
12.0 – 14.0 μm > 40% (multiphonon edge begins) Extended Long-Wave

Values are typical for uncoated double-side polished substrates; AR-coated optics can exceed 97% transmission.

Solar Cells & Photovoltaics

Germanium is the substrate of choice for multi-junction III-V solar cells, with a 0.66 eV bandgap that complements GaAs and InGaP junctions for maximum conversion efficiency.

Space-grade germanium delivers the low EPD, precise orientation, and thermal stability required for satellite power systems.

Germanium wafers also support terrestrial concentrator photovoltaics (CPV) with proven reliability and production scalability.

SiGe & High-Speed Electronics

Silicon-germanium (SiGe) epitaxy on germanium substrates enables heterojunction bipolar transistors (HBTs) with fT/fmax beyond 500 GHz for high-speed digital and RF applications.

Ge and germanium-on-insulator (GOI) platforms continue to enable advanced CMOS and photonic integrated circuits for next-generation computing and optical interconnects.

Radiation Detection

High-purity germanium (HPGe) provides outstanding energy resolution for gamma-ray spectroscopy, making it the reference material for nuclear physics and radiation monitoring.

Germanium supports lithium-drifted Ge(Li) and planar detectors used in security scanning, medical imaging, and environmental monitoring.

Technical Specifications

ParameterAvailable Range / Values
Material Single-crystal Germanium (Ge), 5N+ purity
Diameter 50mm, 100mm, 150mm, 200mm
Dopant / Type N-type (Sb-doped), P-type (Ga-doped), Intrinsic (undoped)
Resistivity N-type: 0.01–40 Ω·cm, P-type: 0.01–30 Ω·cm, Intrinsic: > 40 Ω·cm
Orientation (100), (111), (110), off-cut ±0.5°
Thickness 200μm–1000μm, standard SEMI thicknesses
Surface Polish SSP, DSP, Epi-Ready, RMS < 2Å
EPD (Etch Pit Density) < 5×10³/cm²
TTV / Bow / Warp TTV < 5μm, Bow < 15μm, Warp < 20μm
Bandgap 0.66 eV (indirect)
Electron Mobility 3,900 cm²/V·s
Hole Mobility 1,900 cm²/V·s
IR Transmission Range 2–14μm, n ≈ 4.0
Refractive Index 4.003 @ 10.6μm (CO₂ laser wavelength)
Thermal Conductivity 60 W/m·K
Density 5.323 g/cm³
Packaging Vacuum-sealed, single-wafer shippers, Class 100

Applications

🔭

IR Optics & Thermal Imaging

High refractive index (n ≈ 4.0) and 2–14 μm transmission make germanium the standard material for infrared lenses, windows, and thermal imaging systems.

☀️

Solar Cells & Photovoltaics

Germanium substrates support multi-junction III-V solar cells for space and terrestrial concentrator photovoltaic applications.

⚡

High-Speed Electronics

High electron mobility (3,900 cm²/V·s) and SiGe heteroepitaxy enable high-speed digital circuits, RF devices, and photonic interconnects.

☢️

Radiation Detection

High-purity germanium (HPGe) delivers outstanding energy resolution for gamma-ray spectroscopy, nuclear monitoring, and security screening.

📡

Satellite & Aerospace

Radiation-tolerant germanium substrates support satellite solar arrays, IR optics, and aerospace optoelectronic systems.

🔬

R&D & Specialty Substrates

Custom orientation, doping, and thickness options support research in photonics, quantum technology, and advanced semiconductor devices.

Quality & Certification

GINECHIP germanium wafers are produced under ISO 9001:2015 with 100% inspection, and available to match SEMI M1–M13 standards as well as RoHS/REACH requirements.

Crystal Orientation Check X-ray diffraction verification for (100), (111), and (110) with off-cut ±0.5°.
EPD Measurement Etch pit density limit: < 5×10³/cm².
Wafer Geometry Control Geometry specifications: TTV<5μm, Bow<15μm, Warp<20μm.
AFM Surface Roughness AFM roughness limit: RMS <2Å on a 5×5μm scan.
Resistivity & Hall Mapping N-type: 0.01–40 Ω·cm; P-type: 0.01–30 Ω·cm; Intrinsic: > 40 Ω·cm.
Particle Count (Laser Scan) Particle limit by laser surface scan: ≤10 particles @ 0.3μm.
Laser Mark Verification SEMI M12/M13 compliant soft-mark is applied on the front or back side for laser mark verification.
Visual & Packaging Inspection Final visual and packaging inspection is performed with vacuum-sealed single-wafer shippers in a Class 100 cleanroom.

Request a Germanium Quote

Share your custom specifications and we will prepare a quote. Send your requirements to our team for a fast response.

ISO 9001:2015 5N+ Purity Epi-Ready <2Å RoHS / REACH