MEMS & Sensors — Substrates & Process Services | GINECHIP

Stat Value 1Technology

Stat Value 2Resolution

Stat Value 3Capacity

Stat Value 4Certification

Overview

A comprehensive overview of our capabilities and services.

We deliver industry-leading quality and precision.

H 2Sensor Types

memsSensors.sensor1Name

memsSensors.sensor1Desc

Substrates: Si, SOI, Si-on-GlassKey processes: DRIE, wafer bondingStructures: comb-drive, tuning forkRange: ±2g to ±200g (accel)Range: ±100°/s to ±2000°/s (gyro)Diameters: 150mm, 200mm

memsSensors.sensor2Name

memsSensors.sensor2Desc

Substrates: Si, SOI, Si-on-GlassMembrane: Si or Si₃N₄ diaphragmPiezoresistive: doped Si strain gaugesCapacitive: sealed reference cavityRange: 1 kPa to 100 MPaAnodic/fusion bonding for cavity

memsSensors.sensor3Name

memsSensors.sensor3Desc

Substrates: Si wafers (150mm, 200mm)Membrane: poly-Si or Si₃N₄SNR: 60–73 dB(A)Key processes: sacrificial layer etchPackaging: wafer-level, bottom-portVolume: multi-billion units/year

memsSensors.sensor4Name

memsSensors.sensor4Desc

Substrates: SOI, Si, poly-SiFrequency: 1 MHz–625 MHzStability: ±0.1 ppm (TCXO class)Resonator: DETF, disk, ringProcess: DRIE + vacuum packagingWafer-level hermetic seal

memsSensors.sensor5Name

memsSensors.sensor5Desc

Substrates: Si, SOI, glassSensing film: SnO₂, WO₃, ZnOIntegrated micro-heater (MEMS hotplate)Power: < 15mW (pulsed operation)Detection: ppb-level for some gasesWafer-level packaging compatible

memsSensors.sensor6Name

memsSensors.sensor6Desc

Substrates: Si, glass, SOIMicrofluidics: PDMS, SU-8, glassSurface chemistry: silanization, PEGElectrodes: Au, Pt, ITO, TiNHermetic: anodic bonding, AuSn sealISO 13485 (medical devices)

H 2Substrate Guide

memsSensors.sub1Name

memsSensors.sub1Desc

memsSensors.sub2Name

memsSensors.sub2Desc

memsSensors.sub3Name

memsSensors.sub3Desc

memsSensors.sub4Name

memsSensors.sub4Desc

H 2Process Services

memsSensors.svc1Title

memsSensors.svc1Desc

memsSensors.svc2Title

memsSensors.svc2Desc

memsSensors.svc3Title

memsSensors.svc3Desc

memsSensors.svc4Title

memsSensors.svc4Desc

memsSensors.svc5Title

memsSensors.svc5Desc

memsSensors.svc6Title

memsSensors.svc6Desc

H 2Design

Our engineering team provides comprehensive MEMS design support including mask layout review, design rule checking, process flow optimization, and finite element analysis consultation. We work with your design files in GDSII, CIF, DXF, and other standard formats.

We offer multi-project wafer runs for prototyping and small-volume production, with dedicated process monitoring and in-line metrology. Our MPW service reduces your development cost by sharing mask and process costs across multiple designs.

H 2Packaging

MEMS packaging options include wafer-level capping (anodic, glass frit, metal eutectic), die-level hermetic ceramic packages, and plastic overmolded packages with cavity. Vacuum packaging down to < 1 mTorr is available for inertial sensors and resonators.

H 2Quality

Our quality management system is certified to ISO 9001:2015 with additional compliance to SEMI standards, RoHS, REACH, and Conflict Minerals regulations. Each shipment includes a certificate of conformance with lot traceability back to the original ingot.

CTA Title

Contact our engineering team to discuss your specific requirements and receive a detailed quotation within 24 hours.

Request a Quote Contact Engineers

Meta 1 Meta 2 Meta 3 Meta 4

MEMS Sensors