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PEEK · PFA · PP Material Options
100mm–300mm Wafer Sizes
25-Slot Standard Slot Capacity
SEMI E1·E15·E57 Full Compliance

Overview

Wafer cassettes are the primary interface between your wafers and the rest of the fab — from wet bench processing to furnace loading, from metrology stations to interbay transport. A contaminated, warped, or outgassing cassette can silently degrade yield across an entire lot. At GINECHIP, we supply a complete range of wafer cassettes and carriers engineered for chemical compatibility, thermal stability, and particulate control across every semiconductor process environment.

Our cassette portfolio spans PEEK (polyetheretherketone) — the gold standard for high-temperature wet processing — through PFA and PTFE for aggressive chemical environments, to cost-effective polypropylene cassettes for general cleanroom use. Every cassette is available in ESD-safe and anti-static grades for protection of sensitive gate oxides and advanced CMOS devices.

Cassette Material Selection Guide

PEEK (Polyetheretherketone)

The premier material for semiconductor wafer cassettes. Continuous use temperature of 260°C makes it ideal for furnace loading, hot acid baths, and diffusion processes. Exceptional mechanical strength and dimensional stability through repeated thermal cycling.

  • Temperature: -40°C to +260°C continuous
  • Excellent resistance to acids, bases, and organic solvents
  • Minimal outgassing — suitable for vacuum processes
  • Available in carbon-filled ESD-safe grade (10⁴–10⁹ Ω/sq)

PFA / PTFE (Fluoropolymers)

Near-universal chemical resistance for aggressive semiconductor processes. PFA cassettes withstand concentrated HF, HCl, H₂SO₄, H₂O₂, and SC1/SC2 cleaning chemistries without degradation or leaching. The standard choice for RCA clean and piranha etch stations.

  • Temperature: -200°C to +260°C (PFA)
  • Inert to virtually all process chemicals
  • Ultra-low extractable metals (< 1 ppb)
  • Smooth, non-stick surface minimizes particle adhesion

Anti-Static / ESD-Safe PP

Cost-effective polypropylene cassettes with anti-static additives or conductive carbon loading for ESD protection. Ideal for general wafer transport, storage, and metrology in class 100/ISO 5 and above cleanroom environments.

  • Surface resistivity: 10⁴–10¹¹ Ω/sq (customizable)
  • Static decay: < 0.5 seconds (MIL-B-81705C)
  • Lightweight — reduces AMHS wear and operator fatigue
  • Black or custom colors for process identification

Standard PP (Polypropylene)

Entry-level polypropylene wafer cassettes for non-critical applications. Suitable for wafer storage, shipping, and general handling where extreme chemical or thermal resistance is not required. Most economical option for high-volume operations.

  • Temperature: 0°C to +100°C
  • Good resistance to acids and bases at room temperature
  • Available in natural, white, or custom colors
  • Bulk packaging discounts for fab-wide deployment

Technical Specifications

ParameterAvailable Range / Values
Material PEEK (polyetheretherketone), PFA, PTFE, Polypropylene (PP), Antistatic/ESD PP, Carbon-filled PEEK
Wafer Diameter 100mm (4″), 150mm (6″), 200mm (8″), 300mm (12″)
Slot Capacity 25 slots (standard), 13 slots, 50 slots, custom slot counts
Slot Pitch 4.76mm (3/16″), 6.35mm (1/4″), 9.525mm (3/8″), 12.7mm (1/2″), custom
ESD Protection Static-dissipative: 10⁴–10⁹ Ω/sq surface resistivity; Conductive: < 10⁴ Ω/sq
Temperature Range PEEK: -40°C to +260°C continuous; PFA: -200°C to +260°C; PP: -0°C to +100°C
Cleanroom Class ISO Class 4–5 (Class 10–100) compatible; particle-controlled packaging
Configuration Open cassette, H-Bar, C-Bar, SMIF Pod, FOUP-compatible cassettes
Standards SEMI E1, SEMI E15, SEMI E57, SEMI E158; custom non-SEMI configurations
Chemical Resistance PEEK: excellent acid/alkali/solvent; PFA: near-universal chemical resistance
Outgassing PEEK: < 0.1% TML, < 0.01% CVCM per ASTM E595 (space-grade available)

Cassette Configurations & Automation Compatibility

Open Cassette Types

  • H-Bar Cassette — H-shaped crossbar design for maximum wafer access; preferred for manual loading and wet bench operations
  • C-Bar Cassette — C-shaped end plates with connecting bars; lighter weight, good for transport and storage
  • Full-Body Cassette — Enclosed side walls for maximum wafer protection during transport
  • Custom Slot Configurations — Non-standard slot pitch, depth, and wafer retention features

Automation Interface

  • SMIF Pod Compatible — cassettes designed to interface with Standard Mechanical Interface (SMIF) systems for 150mm/200mm fabs
  • FOUP-Compatible Internal Cassettes — for 300mm Front-Opening Unified Pod internal wafer handling
  • Robot Handling Features — pick-up flanges, alignment notches, and bar-code label surfaces for automated material handling systems (AMHS)
  • RFID Tag Integration — embedded or attached RFID tags for wafer lot tracking (optional)

ESD Protection & Static Control

Electrostatic discharge (ESD) is a leading cause of device damage in advanced semiconductor manufacturing — particularly for thin gate oxides below 2nm in advanced logic nodes. Our ESD-safe cassettes are engineered to meet the most demanding static-control requirements:

Static-Dissipative

Surface resistivity in the 10⁶–10⁹ Ω/sq range. Charges dissipate in a controlled manner — fast enough to prevent accumulation, slow enough to avoid spark discharge. Recommended for most CMOS and MEMS production environments.

Conductive

Surface resistivity below 10⁴ Ω/sq. Rapid charge dissipation for highly sensitive devices. Carbon-filled PEEK or carbon-loaded PP. Grounding connection points available for integration with fab grounding systems.

Anti-Static (Topical)

Surface-treated with anti-static agents to reduce triboelectric charging. Cost-effective for general ESD protection. Note: topical treatments may degrade with repeated wet processing — consider bulk-static-dissipative materials for wet bench use.

Applications

Wet Bench Processing — RCA clean, piranha etch, HF dip, BOE etching — PFA and PEEK cassettes for chemical compatibility
Furnace / Diffusion — High-temperature loading and unloading up to 260°C — PEEK cassettes required
Wafer Transport & Storage — Interbay and intrabay AMHS transport, stocker storage — ESD-safe PP or PEEK
Metrology & Inspection — CD-SEM, defect review, film thickness measurement — low-outgassing, particle-controlled cassettes
CMP Post-Clean — Post-CMP wafer handling with chemical-resistant cassettes for slurry residue environments
R&D & Pilot Lines — Small-quantity, mixed-spec cassette supplies for university and corporate R&D fabs

Quality & Certification

All wafer cassettes are manufactured and packaged under ISO 9001:2015 certified quality management. Each lot undergoes particle counting per IEST-RP-CC005, outgassing testing per ASTM E595 (where applicable), dimensional verification against SEMI standards, and ESD performance validation per ANSI/ESD S20.20. Certificates of Conformance and full material traceability documentation are provided with every shipment.

Need Wafer Cassettes for Your Fab?

Specify your wafer diameter, material preference (PEEK/PFA/PP), ESD requirements, and slot configuration — our team will provide a competitive quote and material recommendation within 24 hours.

ISO 9001:2015 SEMI Standards ESD S20.20 Bulk Discounts