Exhibition & Events
Upcoming semiconductor industry exhibitions, conferences, and trade shows where GINECHIP will be exhibiting or attending.
Overview
The semiconductor industry's most important conversations happen at its trade shows and conferences — where roadmaps get set, partnerships form, and new capabilities get their first public demonstration. GINECHIP exhibits and presents at the major front-end, back-end, and MEMS/sensor events across North America, Europe, and Asia throughout the year.
Beyond the show floor, we schedule private technical meetings, bring customized wafer samples for on-site evaluation, and host on-location seminars for engineering teams who can't travel — see the meeting formats below.
Event Schedule
SEMICON West
Date2025 年 10 月 7–9 日 · Location舊金山 Moscone Center, California, USA
Premier North American semiconductor manufacturing exposition covering the full front-end and back-end supply chain.
Participation FormatLive wafer and substrate sample display with on-site applications engineers available for consultation.
SEMICON China
Date2026 年 3 月 18–20 日 · Location上海新國際博覽中心 (SNIEC), 中國
Asia's largest semiconductor supply chain exhibition, spotlighting domestic equipment, materials, and mature-node capacity expansion.
Participation FormatFull product line demonstration with regional sales and technical support staff on hand.
electronica
Date2025 年 11 月 11–14 日 · LocationMesse München, Munich, Germany
Europe's flagship electronics trade fair, held alongside productronica, covering automotive, industrial power, and MEMS sensor supply chains.
Participation FormatSubstrate and coating samples on display with meetings available by appointment.
SEMICON Japan
Date2025 年 12 月 10–12 日 · Location東京國際展示場 (Tokyo Big Sight), 日本
Japan's flagship semiconductor exhibition, tracking the Rapidus 2nm initiative and government-backed supply chain realignment.
Participation FormatWafer material and advanced packaging substrate showcase with bilingual technical staff.
MEMS & Sensors Executive Congress
Date2025 年 10 月 20–22 日 · LocationSan Diego, California, USA
Executive-level MEMS conference bringing together foundries, sensor fusion, and LiDAR micromirror technologists.
Participation FormatExecutive briefings and one-on-one foundry partnership discussions by appointment.
ISSCC
Date2026 年 2 月 15–19 日 · LocationSan Francisco Marriott Marquis, California, USA
Leading IC design conference covering GAA/CFET device realization, 3D stacking, and chiplet interconnect.
Participation FormatTechnical poster session participation and engineering meet-and-greet at the reception.
IEDM
Date2025 年 12 月 6–10 日 · LocationSan Francisco, California, USA
Premier device physics conference spanning CMOS scaling, emerging memory, power semiconductors, and quantum devices.
Participation FormatSubstrate and materials technical exchange with our device physics team.
ECTC
Date2026 年 5 月 26–29 日 · LocationOrlando, Florida, USA
Flagship advanced packaging conference covering CoWoS/EMIB/Foveros, Cu-Cu hybrid bonding, and interposer technology.
Participation FormatLive RDL and bump wafer demonstrations with packaging applications engineers.
Meet Us
Sales & Business Development
Discuss pricing, volume programs, and long-term supply agreements with our regional account managers.
Applications Engineering
Get technical guidance on material selection, process compatibility, and custom specification design from our engineers.
Quality & Compliance
Review certification documentation, traceability programs, and regulatory compliance with our quality management team.
Executive Leadership
Explore strategic partnerships, capacity planning, and long-term roadmap alignment with our senior leadership.
Past Events
Introduced our expanded 300mm RDL and bump wafer line to more than 500 visiting engineering teams.
Showcased SiC and GaN power substrate capabilities to automotive and industrial power electronics customers.
Announced new wafer reclaim and thin-film coating service lines to the Asia-Pacific supply chain.
Book a Meeting
Schedule a private meeting with our technical team at upcoming exhibitions. We will prepare customized wafer samples, process capability presentations, and preliminary quotations specific to your application before the event.
Can't attend in person? Request a virtual meeting or schedule a visit to our facility. We also offer on-site technical seminars at your location for teams of 5 or more engineers.
Ready to Get Started?
Contact our engineering team to discuss your specific requirements and receive a detailed quotation within 24 hours.