Product Updates
The latest updates to the GINECHIP product catalog — new substrate materials, new service capabilities, and specification changes.
Overview
GINECHIP continuously expands its substrate materials, process capabilities, and certifications to keep pace with the fast-evolving needs of the semiconductor industry. This page tracks our latest additions across substrates, process services, quality certifications, and supply chain.
Each update listed here has been fully qualified and is available for production orders — subscribe below to be notified as new capabilities go live.
Substrate Updates
This quarter's substrate lineup expands with new materials and tighter specifications across our core product families.
150mm Semi-Insulating 4H-SiC
High-purity semi-insulating silicon carbide substrate with resistivity ≥10¹¹ Ω·cm and micropipe density below 0.5 cm⁻², qualified from dual independent suppliers for RF device epitaxy.
300mm FD-SOI
Fully-depleted SOI wafers with a 12nm ultra-thin top silicon layer and 25nm buried oxide, qualified for low-power IoT and edge-AI logic nodes.
200mm BF33 Borosilicate Glass
Borosilicate glass wafers with matched CTE for anodic bonding, available double- or single-side polished for MEMS caps and glass interposer applications.
200mm GaN-on-Si Epitaxy
AlGaN/GaN HEMT epitaxial wafers on high-resistivity silicon with 2DEG mobility above 1,800 cm²/V·s, now offered at prototype and R&D volumes.
150mm InP Substrates
Semi-insulating and n-type indium phosphide wafers with etch pit density below 5,000 cm⁻² for terahertz and photonic device fabrication, now available at the largest commercially qualified diameter.
200mm UV-Grade Fused Silica
Fused silica wafers with >90% transmission at 193nm and 99.99% SiO₂ purity for DUV optical components, available with custom edge profiles.
Process Updates
We've expanded process and service capabilities to support more of your fabrication needs in-house.
New semi-additive process (SAP) line now supports 2/2μm redistribution routing, extending our fine-pitch RDL capability down from the previous 5/5μm standard.
A new pilot line for direct copper hybrid bonding is now qualifying sub-micron die-to-wafer alignment for next-generation 3D-IC stacking.
Every processed wafer now passes through automated AOI with defect classification, reducing outgoing defect rates and improving lot-to-lot consistency.
New reclaim tool sets have doubled monthly throughput, shortening lead times for edge-grinding, strip, and re-polish reclaim services.
Contact our engineering team to discuss how these process expansions can support your current or upcoming projects.
Certification Updates
ISO 9001:2015 Recertification
Our quality management system successfully completed recertification audit with zero major non-conformances across all fabrication and packaging lines.
IATF 16949 Certification Added
Automotive quality management certification now covers our power device and substrate lines, supporting qualification for automotive-grade supply.
RoHS & REACH Compliance Update
All substrate and process material declarations have been refreshed to the latest RoHS 3 and REACH SVHC candidate list revisions.
Conflict Minerals Reporting
Annual conflict minerals disclosure and smelter validation report is now published for customer due-diligence requirements.
Supply Chain Updates
We've continued to invest in supply chain resilience and delivery speed.
Critical substrate materials are now qualified from at least two independent suppliers to reduce single-source supply risk.
Expanded buffer stock at regional distribution points shortens delivery lead times for standard catalog wafers.
Customers can now trace any shipment back to source ingot and process lot through our online traceability portal.
Rolling 12-month capacity forecasting with key accounts improves allocation certainty for high-demand substrates.
Product Roadmap
Here's a preview of what's coming next across our substrate, process, and service offerings.
300mm SiC Capacity Expansion
New reclaim and polishing lines coming online to double our 300mm silicon carbide substrate throughput by next year.
Advanced Packaging Lab
A dedicated RDL and TSV process development lab opening to support faster turnaround on advanced packaging prototypes.
Expanded Metrology Suite
New TXRF and AFM tools coming online to extend in-house contamination and roughness characterization capabilities.
Regional Warehouse Expansion
A new distribution center opening in Southeast Asia to shorten delivery times for our fastest-growing customer region.
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New Products
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Specification Updates
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Pricing Updates
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Contact our engineering team to discuss your specific requirements and receive a detailed quotation within 24 hours.