Chiplet & 2.5D Package
Disaggregating large SoCs into smaller, optimized dies on a silicon interposer — enabling heterogeneous integration, better yields, and lower costs for next-generation processors.
概述
Chiplet architecture is the semiconductor industry's answer to the end of Moore's Law scaling. Instead of building a monolithic system-on-chip (SoC) that must fit within a single reticle limit, designers partition the system into smaller functional blocks (chiplets), each manufactured on its optimal process node, then reassemble them on a silicon interposer using 2.5D packaging. This approach enables larger effective die sizes, heterogeneous integration of logic, memory, and I/O, and improved yield by replacing one large die with multiple smaller ones.
2.5D packaging provides the physical interconnect fabric that makes chiplet integration possible. A silicon interposer with fine-pitch RDL (L/S 0.4/0.4μm) and TSVs serves as the high-density bridge between chiplets. The UCIe (Universal Chiplet Interconnect Express) standard defines the die-to-die interface, with UCIe 2.0 supporting up to 40 Gbps per lane. The industry is rapidly adopting this approach — AMD, Intel, Apple, and NVIDIA all use chiplet-based designs for their latest products.
Key Technology Features
Die Disaggregation
Large SoCs are partitioned into compute dies, memory controllers, I/O dies, and specialized accelerators. Each chiplet is fabricated on its optimal process node — leading-edge logic for compute, mature nodes for I/O, and specialized processes for analog/RF.
Silicon Interposer Routing
The silicon interposer provides the high-density die-to-die wiring, with multi-layer RDL enabling thousands of parallel connections between chiplets. Fine L/S of 0.4/0.4μm supports the bandwidth density required by UCIe and other die-to-die protocols.
UCIe Standard Compliance
UCIe 2.0 defines standard and advanced packaging options with lane speeds up to 40 Gbps. The physical layer specifies bump pitches from 25–55μm for advanced packaging and 100–130μm for standard packaging, enabling a wide range of chiplet integration scenarios.
2.5D Assembly Flow
The assembly process involves die attach (chip-on-wafer), underfill, overmolding, C4 bump formation, and dicing. GINECHIP supports the critical wafer-level processes including RDL fabrication, TSV processing, and bumping that enable the 2.5D integration flow.
GINECHIP Solutions
High-resistivity silicon wafers for interposer fabrication, with tight TTV (<1μm), low warp, and precise resistivity control for optimal electrical performance.
Multi-layer copper RDL fabrication with L/S down to 0.4/0.4μm, including dielectric deposition, lithography, copper plating, and CMP planarization.
μ-bump and C4 bump formation for chiplet-to-interposer and interposer-to-substrate connections, with pitch down to 40μm for advanced packaging.
Dummy wafers and mechanical test wafers for process development and equipment qualification in 2.5D assembly lines, available in all standard diameters.
Target Applications
Chiplet-based designs are now mainstream in data center CPUs (AMD EPYC, Intel Xeon), AI accelerators (NVIDIA B200, AMD MI300X), client processors (Apple M-series, Intel Meteor Lake), and networking ASICs. The approach is also gaining traction in automotive SoCs, where mixing mature automotive-qualified nodes with advanced logic delivers the optimal balance of performance, reliability, and cost.