Smiley
The wafer bends so its centre sits lower than the edges, curving like a smile in side view — a concave, bowl-shaped profile.
Concave · centre below edgeSubstrates · Customization
Warped Wafers
Custom warped silicon wafers with a specified 5–8 mm bow and a smiley, frowny or potato-chip warp shape, for stress research, metrology calibration and handling validation.
5–8 mm Warp / Bow Range
3 profiles Warp Shapes
100mm–300mm Wafer Sizes
On request Made to Order
Overview
A warped wafer is a silicon substrate with a deliberately introduced, controlled bow or warp far beyond normal flatness specifications. Instead of the tens of microns typical of production wafers, these substrates carry 5–8 mm of out-of-plane deformation in a shape the customer selects.
Warped wafers are used where a known, repeatable deformation is the point of the exercise — calibrating bow/warp metrology tools, teaching stress and flatness concepts, validating packaging and handling processes, and visualizing thin-film stress. GINECHIP produces them to a specified magnitude and one of three canonical warp shapes.
Warp Shapes
Frowny
The wafer bows upward so its centre rises above the edges, like a frown in side view — a convex, dome-shaped profile.
Convex · centre above edgePotato Chip
A saddle-shaped double curvature: one axis bends up while the perpendicular axis bends down, like a potato chip.
Saddle · opposite curvature per axisSpecifications
| Parameter | Specification |
|---|---|
| Warp / Bow magnitude | 5–8 mm (customer-specified) |
| Warp shape | Smiley · Frowny · Potato chip |
| Substrate | Silicon (CZ, FZ) |
| Wafer diameter | 100mm · 150mm · 200mm · 300mm |
| Thickness | 300–775 μm (standard thicknesses) |
| Magnitude tolerance | ±1 mm on specified warp |
| Surface finish | As-specified (prime / test grade) |
| Packaging | Warp-preserving cassette |
Applications
Stress research & characterization
Controlled large warp makes thin-film and process-induced stress visible and quantifiable.
Metrology tool calibration
Reference wafers with known warp magnitude and shape calibrate bow/warp measurement tools.
Training & demonstration
Physical warped wafers illustrate stress and flatness concepts for education and customer training.
Packaging & bonding validation
Verify handling, bonding and warpage-control processes against known extreme geometries.
Handling & automation testing
Test cassette, robot and end-effector handling against heavily warped substrates.
Thin-film stress visualization
Demonstrate stress-induced deformation from deposited films and thermal mismatch.
GINECHIP Warped Wafer Capabilities
GINECHIP produces warped wafers as a controlled customization rather than an accidental outcome, so the delivered substrate carries the requested magnitude and shape, verified by measurement before shipment.
Controlled warp engineering
Processes that introduce a specified warp magnitude of 5–8 mm and a chosen shape reproducibly across a batch.
Shape & magnitude precision
Smiley, frowny and potato-chip profiles held to tolerance on both warp amount and form.
Metrology verification
Every wafer is measured and reported for bow and warp to confirm it meets the target profile before shipment.
Customization & scale
Single-wafer engineering runs to small batches across 100–300 mm diameters, with one certificate of conformance per lot.
Need a Warped Wafer to Specification?
Send your target warp magnitude, shape and wafer diameter — our engineers will confirm the achievable profile and return a quotation within 24 hours.