+86 18086440080
lucas@ginechip.com
WhatsApp
English
Language
English
繁體中文
日本語
Русский
Deutsch
עברית
한국어
Sign In
Substrates
Materials
Silicon Wafer Substrate
▾
Prime Silicon Wafers
Test / Monitor Wafers
Dummy / Mechanical Wafers
Reclaimed Wafers
Ultra-Thin / Taiko Wafers
FZ High-Resistivity Wafers
SOI Wafers
Thermal Oxide on Silicon
Nitride on Silicon (Si₃N₄)
Silicon Epi Wafers
Silicon Interposer
CMP Bonding Wafer
Square Silicon Wafers
Compound Semiconductors
▾
SiC Wafer Substrate
Gallium Arsenide (GaAs)
GaN on Sapphire
Indium Phosphide (InP)
Glass Substrates
▾
Fused Silica / Quartz
Borofloat 33 Glass
Sapphire (Al₂O₃)
Single Crystal Quartz
Glass Panels
TGV Wafer
Coated Substrates
▾
TEOS Oxide on Silicon
Lithium Niobate (LiNbO₃)
Lithium Tantalate (LiTaO₃)
ITO-Coated Glass/Substrates
Silicon on Sapphire (SOS)
Other Materials
▾
Germanium (Ge)
Graphene on Substrates
Ingots & Bulk Sale
▾
Silicon Ingots
Compound Ingots
Customization
Material Customization
Pattern Customization
Film & Coating Customization
Daisy Chain Wafers
Dummy Die Fabrication
RDL Bump Wafer
MEMS Process
Lithography & Deposition
Photolithography
Thin-Film Coating & Deposition
Plasma-Enhanced CVD (PECVD)
Distributed Bragg Reflector (DBR)
Wet & Dry Etching (DRIE)
Advanced Processes
Wafer Bonding
Polyimide (PI) Processing
Ion Implantation & Doping
Through-Silicon Via (TSV)
Through-Glass Via (TGV)
Wafer Bumping & UBM
Redistribution Layer (RDL)
Reprocessing
Reclaim Services
Wafer Reclaim
Chemical Cleaning
Edge Grinding
Wafer Resizing
Laser Marking & Re-ID
Certification & Measurement
Flatness Re-Certification
TTV / Bow / Warp Measurement
Particle Count Certification
Custom Reclaim Protocols
Accessories
Handling & Packaging
Wafer Cassettes (PEEK, ESD-safe)
Wafer Frames & Rings
Shipping Boxes & Carriers
IC / Die Boxes
Process Materials
Lithography Masks (Photomasks)
Photoresists & Chemicals
Low-Yield / Scrap Dies & Wafers
Resources
Applications
MEMS & Sensors
RF & Power Devices
Photonics & LiDAR
Power Electronics (SiC/GaN)
Advanced Packaging
▾
CoPoS
CPO
CoWoS
Chiplet & 2.5D Package
Hybrid Bonding
Glass Substrate
3D Package & HBM
HVDC
R&D & Prototyping
Technical Articles
Blog
Technical Articles
Company
Company
About
Company News
Exhibition & Events
Industry Insights
Product Updates
Contact
Shop
Cart
0
Shopping Cart
0 items
Your cart is empty
Substrates
Materials
Silicon Wafer Substrate
Prime Silicon Wafers
Test / Monitor Wafers
Dummy / Mechanical Wafers
Reclaimed Wafers
Ultra-Thin / Taiko Wafers
FZ High-Resistivity Wafers
SOI Wafers
Thermal Oxide on Silicon
Nitride on Silicon (Si₃N₄)
Silicon Epi Wafers
Silicon Interposer
CMP Bonding Wafer
Square Silicon Wafers
Compound Semiconductors
SiC Wafer Substrate
Gallium Arsenide (GaAs)
GaN on Sapphire
Indium Phosphide (InP)
Glass Substrates
Fused Silica / Quartz
Borofloat 33 Glass
Sapphire (Al₂O₃)
Single Crystal Quartz
Glass Panels
TGV Wafer
Coated Substrates
TEOS Oxide on Silicon
Lithium Niobate (LiNbO₃)
Lithium Tantalate (LiTaO₃)
ITO-Coated Glass/Substrates
Silicon on Sapphire (SOS)
Other Materials
Germanium (Ge)
Graphene on Substrates
Ingots & Bulk Sale
Silicon Ingots
Compound Ingots
Customization
Material Customization
Pattern Customization
Film & Coating Customization
Daisy Chain Wafers
Dummy Die Fabrication
RDL Bump Wafer
MEMS Process
Lithography & Deposition
Photolithography
Thin-Film Coating & Deposition
Plasma-Enhanced CVD (PECVD)
Distributed Bragg Reflector (DBR)
Wet & Dry Etching (DRIE)
Advanced Processes
Wafer Bonding
Polyimide (PI) Processing
Ion Implantation & Doping
Through-Silicon Via (TSV)
Through-Glass Via (TGV)
Wafer Bumping & UBM
Redistribution Layer (RDL)
Reprocessing
Reclaim Services
Wafer Reclaim
Chemical Cleaning
Edge Grinding
Wafer Resizing
Laser Marking & Re-ID
Certification & Measurement
Flatness Re-Certification
TTV / Bow / Warp Measurement
Particle Count Certification
Custom Reclaim Protocols
Accessories
Handling & Packaging
Wafer Cassettes (PEEK, ESD-safe)
Wafer Frames & Rings
Shipping Boxes & Carriers
IC / Die Boxes
Process Materials
Lithography Masks (Photomasks)
Photoresists & Chemicals
Low-Yield / Scrap Dies & Wafers
Resources
Applications
MEMS & Sensors
RF & Power Devices
Photonics & LiDAR
Power Electronics (SiC/GaN)
Advanced Packaging
CoPoS
CPO
CoWoS
Chiplet & 2.5D Package
Hybrid Bonding
Glass Substrate
3D Package & HBM
HVDC
R&D & Prototyping
Technical Articles
Blog
Technical Articles
Company
Company
About
Company News
Exhibition & Events
Industry Insights
Product Updates
Contact
Shop
Cart
Sign In
Home
/
Shop
/
SOI Wafers
/
SOI Wafer 200mm (1µm BOX)
SKU: GCP-SOI-200
In Stock
SOI Wafer 200mm (1µm BOX)
$150.00
Silicon-on-insulator wafer with 1µm buried oxide.
Category:
SOI Wafers
Quantity
-
+
Add To Cart
Request a Quote
ISO 9001 Certified
Secure Checkout
Fast Shipping
Browse by category:
Compound Semiconductors
Glass Substrates
Sapphire
Silicon Carbide
Silicon Wafers
SOI Wafers
