Metal Wafer Frames
Precision stainless steel and aluminum wafer frames for production dicing, engineered for K&S, ESEC, and DISCO equipment.
Overview
Metal wafer frames form the mechanical backbone of the dicing and die-attach process, holding a tape-mounted wafer under uniform tension while the dicing saw singulates individual dies. GINECHIP supplies precision stainless steel (SUS304/SUS316) and aluminum (6061-T6) frames machined to tight flatness tolerances, ensuring consistent tape tension across the full frame diameter and eliminating tape sag that can cause die chipping or saw blade deflection.
Every frame is available in anodized aluminum for lightweight handling or passivated stainless steel for maximum durability and chemical resistance in repeated cleanroom cycling. Single-frame and dual-frame (stacked) configurations support both standard and thin-wafer dicing workflows, with full compatibility across K&S, ESEC, and DISCO automated die-bonding and dicing platforms.
Technical Specifications
| Parameter | Available Range / Values |
|---|---|
| Material | Stainless steel (SUS304, SUS316), Aluminum (6061-T6, anodized) |
| Wafer Compatibility | 100mm (4″), 150mm (6″), 200mm (8″), 300mm (12″) |
| Equipment Compatibility | K&S, ESEC, DISCO, Kulicke & Soffa dicing/die-bonding platforms |
| Thickness | 1.2mm–1.5mm (standard), custom on request |
| Surface Finish | Anodized (aluminum), passivated (stainless steel) |
| Configuration | Single-frame or dual-frame (stacked) designs |
| Flatness | < 0.1mm across frame plane |
| Standards | SEMI G74, SEMI G87 compatible geometries |
Applications
High-throughput automated dicing operations where frame flatness and dimensional repeatability directly affect die yield and equipment uptime.
Frame-mounted wafers transported between dicing, die attach, and wire bonding stations require dimensionally stable frames for robotic pick-and-place accuracy.
Outsourced assembly and test facilities running mixed-lot volumes benefit from standardized, interchangeable frame geometries across multiple customer specifications.
Fabs running cost-optimization programs can source replacement frames matched to legacy equipment generations no longer supported by original tooling vendors.
Quality & Certification
Every metal wafer frame is manufactured under ISO 9001:2015 certified quality management, with dimensional inspection against SEMI G74/G87 geometry references and 100% flatness verification prior to shipment. Certificates of conformance are provided for lot traceability.
Need Metal Wafer Frames?
Specify your wafer diameter, dicing equipment, and frame material — our team will confirm compatibility and provide a detailed quotation within 24 hours.