Backgrinding & Surface Protection Tape
Backgrinding protection tape and surface protection films with residue-free removal and temperature resistance up to 200°C.
Overview
Backgrinding tape protects the delicate device-side circuitry of a wafer while the backside is mechanically ground down to final device thickness — a process that generates significant heat, particulate debris, and vibration. GINECHIP's backgrinding tapes are engineered to withstand grinding-induced temperatures up to 200°C without adhesive breakdown, while forming a tight particle seal that keeps grinding slurry and silicon debris away from active circuitry.
After grinding, the tape must release with zero adhesive residue — any organic contamination left on the front-side circuitry can compromise subsequent bonding, bumping, or packaging yield. GINECHIP offers controlled adhesion from 100 to 1000 gf/25mm, matched to grind depth and wafer material, along with surface protection film variants for handling and transport steps that do not involve grinding heat.
Technical Specifications
| Parameter | Available Range / Values |
|---|---|
| Type | Backgrinding (BG) tape, surface protection film |
| Thickness | 100μm–400μm |
| Adhesion (Peel Strength) | 100–1000 gf/25mm, controlled per grind depth |
| Removal | Residue-free removal after grinding/processing |
| Temperature Resistance | Up to 200°C |
| Wafer Compatibility | 100mm–300mm |
| Base Film | PO (polyolefin), PVC options with UV-release variants |
| Standards | Compatible with DISCO, Okamoto, Strasbaugh backgrinders |
Applications
Standard backgrinding operations for advanced packaging and 3D-IC processes requiring precise final thickness control.
High-temperature-tolerant tapes protect front-side circuitry during aggressive grinding required for power device backside processing.
General-purpose surface protection film variants guard patterned wafer surfaces during intermediate transport steps that do not involve grinding.
Backgrinding tape used in Taiko edge-ring processes leaves the outer support ring un-ground for added mechanical strength during thin-wafer handling.
Quality & Certification
Every backgrinding tape lot is tested for residue-free release, temperature stability, and adhesion consistency under ISO 9001:2015 certified quality management, with certificates of conformance provided per shipment.
Need Backgrinding Tape?
Tell us your grind depth, wafer material, and final device thickness — our team will recommend the right tape and provide a quote within 24 hours.