Dicing Tape
UV-curable and non-UV dicing tapes on PVC, PO, and PET base films with controlled peel strength for clean die separation.
Overview
Dicing tape is the mechanical interface between a full wafer and its final singulated dies — mounted onto a frame, the tape must hold every die securely through blade or laser dicing while resisting coolant infiltration and blade drag, then release each die cleanly during pick-up without adhesive residue or die shift. GINECHIP supplies both <strong>UV-curable</strong> tapes, whose acrylic adhesive cross-links under UV exposure to drop peel strength for near-zero-force die release, and <strong>non-UV pressure-sensitive</strong> tapes for processes where UV equipment is unavailable or unwanted.
Base films in PVC, polyolefin (PO), and PET are matched to specific dicing saws and expansion requirements: PVC offers superior expandability for die-sorting after dicing, PO delivers excellent chemical resistance and low outgassing, and PET provides the highest dimensional stability for laser dicing and stealth-dicing processes. Controlled peel strength across a 50 to 1500 gf/25mm range accommodates everything from delicate MEMS dies to robust power device singulation.
Technical Specifications
| Parameter | Available Range / Values |
|---|---|
| Type | UV-curable, non-UV (thermal-release variants available) |
| Base Film | PVC, PO (polyolefin), PET |
| Adhesive System | Acrylic, synthetic rubber |
| Thickness | 80μm–150μm |
| Adhesion (Peel Strength) | 50–1500 gf/25mm, controlled per application |
| Wafer Compatibility | 100mm–300mm |
| UV Curing | Adhesion drops to < 10 gf/25mm after UV exposure for clean die pick |
| Standards | Compatible with DISCO, ADT, K&S dicing saws and die bonders |
Applications
PET-based tapes provide dimensional stability for stealth dicing and laser grooving processes on advanced logic and memory wafers.
PVC-based tapes with superior expandability increase die-to-die spacing after dicing for reliable robotic pick-up in high-mix assembly lines.
Low-adhesion UV tapes minimize the pick-up force required for delicate MEMS and thin-die structures, reducing die cracking and yield loss.
High-adhesion PO tapes hold thick power device wafers securely through aggressive dicing without shifting or lifting.
Quality & Certification
Every dicing tape lot is tested for peel strength, UV-cure response, and dimensional stability under ISO 9001:2015 certified quality management. Certificates of conformance with lot traceability are provided with every shipment.
Need Dicing Tape?
Specify your dicing method, wafer thickness, and required peel strength — our team will recommend the right tape and provide a quote within 24 hours.