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100mm–300mmWafer Diameter
CNC Conductive FoamCushioning
Vacuum · N₂ BackfillSealing Options
ISO Class 4–5Cleanroom Class

Overview

Single-wafer shippers are the highest level of protection in GINECHIP's packaging portfolio, purpose-built for wafers whose replacement cost or lead time makes any damage unacceptable. Each wafer is suspended in a CNC-machined conductive foam pocket with controlled compression, eliminating wafer-to-wafer contact entirely and isolating the substrate from shock, vibration, and electrostatic discharge during transit.

Optional hermetic vacuum sealing and nitrogen backfill extend protection to oxidation-sensitive surfaces and moisture-critical film stacks, while shock and tilt indicator labels give receiving inspectors an immediate visual record of handling events in transit. GINECHIP assembles every single-wafer shipper in an ISO Class 4–5 cleanroom to prevent particle contamination before the box is ever sealed.

Technical Specifications

ParameterAvailable Range / Values
Wafer Diameter100mm (4″), 150mm (6″), 200mm (8″), 300mm (12″)
Cushion MaterialCNC-machined conductive PE/PU foam, custom-profiled per wafer type
Wafer RetentionIndividually suspended, controlled compression, zero wafer-to-wafer contact
SealingStandard snap-lid, optional hermetic vacuum port
Backfill GasDry nitrogen or argon (optional, with vacuum-sealed variant)
ESD ProtectionStatic-dissipative 10⁴–10⁹ Ω/sq; conductive foam variant < 10⁴ Ω/sq
IndicatorsShock indicator label (25G/50G/75G), tilt indicator (optional)
Cleanroom ClassISO Class 4–5 (Class 10–100) assembled and packaged
StandardsSEMI E154, ISTA 3A, ASTM D4169

Applications

SOI & Patterned Wafer Shipment

Individually cushioned protection for high-value SOI substrates and patterned wafers where any surface contact risk is unacceptable.

Reticle & Photomask-Grade Blanks

Foam geometries adapted for reticle-grade blanks and specialty optical substrates requiring maximum surface protection.

Foundry-to-OSAT Transfer

Secure single-lot handoff of finished wafers between wafer fabs and outsourced assembly and test (OSAT) partners.

R&D Sample Exchange

Compact, secure shipping for one-off wafer samples exchanged between university, corporate, and pilot-line labs.

Quality & Certification

Every single-wafer shipper is assembled and sealed under ISO Class 4–5 cleanroom conditions, with each design revision drop-tested per ISTA 3A and every lot verified for particle count and, where specified, outgassing performance per ASTM E595. Full ISO 9001:2015 traceability documentation accompanies every shipment.

Need Single-Wafer Shippers?

Tell us your wafer diameter, sealing requirement, and shipment volume — our packaging specialists will confirm foam design and lead time within 24 hours.

ISO 9001:2015 ISTA 3A Tested ESD-Safe Vacuum-Seal Option