Substrate · Materialien
Glassubstrate
Präzisions-Glaswafer für MEMS, Mikrofluidik und Wafer-Level-Optik.
Fused Silica · Borosilicate · QuartzMaterial Options
100mm–300mmDiameter Range
> 90% TransmissionUv To Near IR
RMS < 0.5nmCmp Surface Finish
Übersicht
Overview Paragraph 1
Overview Paragraph 2
Material Types
Fused Silica Name
Fused Silica Description
- Transmission: 185nm–2.1μm with > 90% T
- Extremely low autofluorescence
- High laser damage threshold
- Available in JGS1 (UV), JGS2, JGS3 grades
- CMP-finished to sub-nanometer RMS
Borofloat Name
Borofloat Description
- CTE: 3.25 ppm/K — matched to silicon
- Transformation temp: 525°C
- High chemical resistance (hydrolytic class 1)
- Available DSP with excellent flatness
- Suitable for through-glass via (TGV) processing
Af 32Name
Af 32Desc
- CTE: 3.2 ppm/K — silicon-matched
- Low dielectric loss: tan δ ~ 0.004 at 10 GHz
- Available as thin as 100μm
- Excellent for TGV interposers in 2.5D packaging
- No alkali migration issues for TFT backplanes
D 263Name
D 263Desc
- Available in thicknesses from 30μm–1100μm
- High transmission from 350nm–2.5μm
- Refractive index n = 1.5230
- Smooth fire-polished surface
- Cost-effective for high-volume applications
Single Crystal Quartz Name
Single Crystal Quartz Description
- Piezoelectric coefficient d₁₁ = 2.31 pC/N
- AT-cut for temperature-stable resonators
- High Q-factor for low phase noise oscillators
- Available from 2″ to 4″ wafers
- Custom crystallographic orientations
Soda Lime Name
Soda Lime Description
- Soda-lime: lowest cost, widely available
- Aluminosilicate: high scratch resistance
- Custom glass compositions supported
- Thin (< 100μm) and ultra-thin available
- Prototyping and small-batch friendly
Technische Spezifikationen
| Parameter | Verfügbarer Bereich |
|---|---|
| Materials | Fused Silica (SiO₂), Borosilicate Glass (Borofloat® 33, AF32® eco, D263®), Quartz (single-crystal), Soda-Lime, Alkali-Free Glass |
| Diameter | 100mm (4″), 150mm (6″), 200mm (8″), 300mm (12″) |
| Thickness | 100μm–1100μm (ultra-thin 50μm available for flexible substrates) |
| Surface Quality | DSP, SSP, CMP-finished; S/D 40/20 or better per MIL-PRF-13830B |
| Surface Roughness | RMS < 0.5nm (CMP), < 1.0nm standard polish |
| TTV / Bow / Warp | TTV < 3μm, Bow < 20μm (fused silica); custom specifications available |
| CTE | 0.55 ppm/K (fused silica), 3.2 ppm/K (AF32), 7.2 ppm/K (D263), 3.25 ppm/K (Borofloat) |
| Transmission | > 90% from 185nm–2.1μm (fused silica); D263: > 90% from 350nm–2.5μm |
| Refractive Index (n₅₈₉) | Fused Silica: 1.458; Borosilicate: 1.471–1.473; D263: 1.523; AF32: 1.510 |
| Dielectric Constant | 3.8 (fused silica), 4.6 (borosilicate), 5.1–6.9 (alkali-free glass) at 1 MHz |
| Packaging | Interleaved with cleanroom paper, single-wafer cassette, vacuum-sealed outer bag |
Anwendungen
glassSubstrates.app1Title
glassSubstrates.app1Desc
glassSubstrates.app2Title
glassSubstrates.app2Desc
glassSubstrates.app3Title
glassSubstrates.app3Desc
glassSubstrates.app4Title
glassSubstrates.app4Desc
glassSubstrates.app5Title
glassSubstrates.app5Desc
glassSubstrates.app6Title
glassSubstrates.app6Desc
Tgv Technology
Tgv Description