Wafer-Bumping & UBM
Lot-Bumps, Cu-Pillars, Au-Studs mit vollständigem UBM-Stack.
Übersicht
Bumping ist die Schlüsseltechnologie für Flip-Chip und 3D.
Bumps: Lot, Cu-Pillars, Au. Pitch 130–10 μm. 200/300 mm.
Bumping-Technologien
Lot-Bumps (SnAg/Cu, SAC305)
Lot-Bumps 130–250 μm. SAC305, SnAg. RoHS.
Cu-Pillar-Bumps
Cu-Pillars 40–80 μm. Höhe 20–60 μm. Für 3D.
Au-Stud-Bumps
Au-Studs > 60 μm. Für Optoelektronik. < 150°C.
Micro-Bumps (Cu/SnAg, 10–55 μm)
Micro-Bumps 10–55 μm für 3D-IC. HBM, Chiplets.
Heading Ubm Stacks
Under-Bump Metallization provides the adhesion, diffusion barrier, and solder-wetting layers required for reliable wafer bumping. We offer a range of UBM stacks optimized for different solder types, pitch requirements, and reliability profiles.
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Heading Process Flow
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Typische Anwendungen
Flip-Chip Cu-Pillars/Lot. L < 0,1 nH.
Micro-Bumps 10–40 μm für HBM. TSV-kompatibel.
Bumps für CIS. Niedertemperatur-Bonden.
Au-Studs und Cu-Pillars für HF/mmWave. Lpar < 0,05 nH.
Au-Bumps für LED- und Micro-LED-Displays.
Heading Reliability
Environmental reliability testing includes temperature cycling, HAST, high-temperature storage, and mechanical shock per MIL-STD and JEDEC standards. Bonded wafer pairs are qualified for your application-specific environmental conditions.
Heading QA
Our metrology laboratory maintains ISO 17025 accreditation with NIST-traceable reference standards. All measurement equipment undergoes daily calibration verification with certified reference wafers, and our measurement uncertainty is documented for each parameter type.
Wafer-Bumping nötig?
Geben Sie Bump-Typ, Pitch, UBM-Anforderungen an. Angebot innerhalb 24h.