Wafer-Reclaim
Chemisch-mechanisches Abtragen und Wiederpolieren gebrauchter Test-Wafer.
Übersicht
Wafer-Reclaim senkt Kosten um 50–70%.
Chemisches Strippen + CMP + Reinigung.
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Schichtentfernung
Chemische Entfernung von SiO₂, Si₃N₄, Metallen, Fotolack.
CMP-Wiederpolitur
CMP auf Ra < 0,5 nm. TTV < 2 μm nach Reclaim.
Reinigungsprozess
RCA-1/2-Reinigung. Metalle < 5E10 Atome/cm².
Metrologie-Neuzertifizierung
Vollständige Neuzertifizierung: TTV, Rauheit, Partikel.
Kundenspezifische Entwicklung
DOE-Entwicklung für Spezialsubstrate: GaAs, SiC, InP, Saphir.
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Eingangsinspektion
Eingangsinspektion. Sortierung nach Schichttyp.
Chemische Entfernung
Chemische Entfernung in Bädern. Konzentrationskontrolle.
CMP-Wiederpolitur
Multi-Platen-CMP. In-situ-Kontrolle.
Reinigung
Automatische RCA-1/2-Reinigung. Marangoni-Trocknung.
Endkontrolle
TTV, Rauheit, Partikel, Mikroskopie.
Verpackung & Zertifizierung
Verpackung, Zertifikat, SPC-Daten.
Qualitätsspezifikationen
| Th Param | Th Target | Th Method |
|---|---|---|
| Surface Roughness (Ra) | waferReclaim.q1Target | waferReclaim.q1Method |
| TTV (post-reclaim) | waferReclaim.q2Target | waferReclaim.q2Method |
| Bow / Warp | waferReclaim.q3Target | waferReclaim.q3Method |
| Surface Metal Contamination | waferReclaim.q4Target | waferReclaim.q4Method |
| Particle Adders (> 0.2μm) | waferReclaim.q5Target | waferReclaim.q5Method |
| Film Residue | waferReclaim.q6Target | waferReclaim.q6Method |
| Edge Exclusion | waferReclaim.q7Target | waferReclaim.q7Method |
| Reclaim Cycles (before thin-out) | waferReclaim.q8Target | waferReclaim.q8Method |
Table Note
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Cost Analysis Title
Wafer reclaim delivers significant cost savings compared to new prime wafers, typically 60–80% lower cost. For high-volume fabs processing thousands of monitor and test wafers per month, reclaim programs can reduce annual substrate spending by millions of dollars.
Sustainability Title
Wafer reclaim reduces the environmental footprint of semiconductor manufacturing by extending wafer useful life. Each reclaimed wafer saves approximately 2.5 kWh of energy and 5 liters of water compared to manufacturing a new wafer, while diverting high-purity silicon from waste streams.
Heading Cycle Mgmt
Each reclaimed wafer is tracked through its entire lifecycle including reclaim cycle count, remaining thickness, and historical inspection data. Our cycle management system helps you optimize reclaim frequency and predict end-of-life for each wafer.
Heading Sub Compat
Our reclaim processes support silicon wafers of all common dopant types, orientations, and diameters. We also offer reclaim for SOI, glass, and compound semiconductor substrates with dedicated process chemistries for each material system.
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Our metrology laboratory maintains ISO 17025 accreditation with NIST-traceable reference standards. All measurement equipment undergoes daily calibration verification with certified reference wafers, and our measurement uncertainty is documented for each parameter type.
Starten Sie Ihr Reclaim-Programm
Nennen Sie Wafer-Typ, Schichtstapel, Volumen. Antwort innerhalb 24h.