Glass Panels for Advanced Packaging
Large-area glass panels (510×515mm, 600×600mm) for CoPoS panel-level packaging, TGV interposers, and antenna-in-package applications. Borosilicate, fused silica, and alkali-free grades with CMP surface finish.
Overview
Glass panels represent the next paradigm shift in advanced semiconductor packaging, transitioning from round 300mm silicon wafers to square glass panels with edge lengths of 500mm and beyond. At 510×515mm, a single glass panel delivers 4.5× the usable area of a 300mm round wafer, with 95%+ area utilization versus the ~65% achievable on circular substrates. This fundamental geometry advantage translates directly to cost-per-die reduction of 20–30% in high-volume manufacturing.
GINECHIP supplies glass panels in borosilicate, fused silica, and alkali-free grades, with CMP-polished surfaces ready for TGV formation, RDL metallization, and heterogeneous integration. Our panels are available in standard sizes from 510×515mm to 650×750mm, with custom dimensions available for specialized applications. All panels undergo rigorous metrology including CTE verification, TTV/warp interferometry, surface roughness AFM, and particle inspection.
Glass Panel Grades
Borosilicate Glass Panels
CTE MatchedBorosilicate glass panels with CTE of 3.25 ppm/K — nearly identical to silicon (2.6 ppm/K). The CTE match enables low-stress integration with silicon interposers and chiplets during thermal cycling. Panel sizes up to 510×515mm deliver 4.5× the usable area of a 300mm round wafer, dramatically reducing cost-per-die in panel-level packaging (PLP) flows.
Fused Silica Panels
Low Loss RFHigh-purity fused silica panels with near-zero CTE (~0.55 ppm/K) and ultra-low dielectric loss (tan δ < 0.001). Ideal for mmWave antenna-in-package and RF interposer applications where signal integrity is paramount. The exceptional thermal stability eliminates warpage during high-temperature TGV metallization and multi-layer RDL processing.
Alkali-Free Glass Panels
Display GradeAN100 and EAGLE XG alkali-free glass panels developed for flat-panel display manufacturing, now adapted for advanced semiconductor packaging. CTE of ~3.8 ppm/K with excellent thickness uniformity and surface quality inherited from Gen 6+ glass production lines. Compatible with TGV formation and Cu plating processes.
Technical Specifications
| Parameter | Specification |
|---|---|
| Material | Borosilicate glass, Fused silica, Alkali-free glass (AN100, EAGLE XG) |
| Panel Size | 510×515mm, 600×600mm, 650×750mm (custom available) |
| Thickness | 0.3mm – 1.1mm (standard), 0.1mm – 3.0mm (custom) |
| CTE (20–300°C) | 3.2 – 8.5 ppm/K (grade-dependent) |
| TTV | ≤ 5μm (panel), ≤ 2μm (wafer) |
| Surface Roughness (AFM RMS) | < 1.0nm (CMP finish), < 0.5nm (advanced CMP) |
| Warp | ≤ 50μm per 515mm panel edge |
| Dielectric Constant | 4.0 – 5.5 at 1 MHz (grade-dependent) |
| Loss Tangent @ 1 MHz | < 0.005 (borosilicate), < 0.001 (fused silica) |
| Transmission Range | > 90% from 310nm to 2,700nm (borofloat grade) |
| Strain Point | 525°C (borosilicate), 1,000°C+ (fused silica) |
| Surface Finish | CMP, fire-polished, lapped, or as-cut |
| Edge Quality | Ground, polished, or chamfered edges |
| Packaging | Interleaved cleanroom paper, vacuum-sealed cassette or panel cassette |
Applications
Glass panels serve as the core substrate in CoPoS architecture, replacing traditional round silicon interposers with square panels. The 510×515mm panel format achieves 95%+ area utilization versus ~65% for 300mm wafers, enabling 4.5× more dies per substrate. TGV (Through-Glass Via) metallization provides vertical interconnects, while multi-layer RDL on the glass surface routes signals between chiplets.
Laser-drilled or wet-etched TGVs in glass panels provide low-loss RF interposers for 2.5D and 3D packaging. The low dielectric constant (4.0–5.5) and low loss tangent of glass reduce signal attenuation compared to silicon interposers, making them particularly attractive for mmWave, RF front-end modules, and high-speed digital interconnects.
Glass panels with ultra-low dielectric loss (fused silica grade) are the substrate of choice for 5G mmWave and 6G antenna-in-package modules. The ability to form high-aspect-ratio TGVs enables compact antenna arrays with integrated beamforming ICs, while the dimensional stability of glass ensures precise antenna element placement across the entire panel.
Fan-out panel-level packaging leverages the large-area format of glass panels to embed multiple ICs in a molded reconstituted panel. The glass carrier provides mechanical support during molding, RDL formation, and chip-last attach processes. After processing, the glass panel can be either retained as a permanent interposer or released, depending on the package architecture.
Glass panels with integrated optical waveguides (via ion-exchange or laser writing) enable photonic interposers that combine electrical routing (Cu RDL) with optical routing (waveguides) on a single substrate. This co-integration is critical for co-packaged optics (CPO) and high-bandwidth optical I/O applications.
Thick glass panels (0.7–1.1mm) with high thermal stability and electrical isolation serve as substrates for high-voltage power modules in EV traction inverters, industrial motor drives, and grid-tied converters. The absence of parasitic capacitance improves switching performance compared to DBC ceramic substrates.
Quality & Metrology
CTE Dilatometry
Thermomechanical analysis (TMA) per ASTM E831 from 20°C to 300°C. Certified CTE values with ±0.1 ppm/K tolerance. Critical for CTE matching with silicon and copper in multi-material stacks.
AFM Surface Roughness
Atomic force microscopy over 1×1μm and 10×10μm scan areas. CMP-polished surface < 1.0nm RMS; advanced CMP finish < 0.5nm RMS. Data included per lot for RDL-adhesion-critical applications.
TTV / Warp Interferometry
Full-panel topography via grazing-incidence interferometry. TTV ≤ 5μm, Warp ≤ 50μm for 510×515mm panels. Per SEMI MF1530 / MF1390 adapted for panel format.
Optical Transmission Spectroscopy
UV-Vis-NIR transmission from 200nm to 3,300nm. Certified > 90% transmission from 310nm to 2,700nm (borofloat). Inspection for striae, bubbles, and inclusions.
Dielectric Characterization
Parallel-plate capacitance measurement at 1 kHz – 10 GHz. Dielectric constant (εr) and loss tangent (tan δ) certified per IPC-TM-650 2.5.5.9. Critical for RF interposer and mmWave applications.
Laser Surface Particle Scan
Particle inspection at 0.3μm sensitivity per SEMI M53. Standard specification: ≤ 20 particles per panel. Tighter specifications for TGV-lithography applications.
X-Ray Fluorescence (XRF)
Compositional verification of glass constituents. Confirms lot-to-lot consistency and compliance with manufacturer specifications.
Chemical Durability Testing
Hydrolytic resistance per ISO 719, acid resistance per DIN 12116, alkali resistance per ISO 695. Ensures compatibility with wet chemical processes (TSV etch, Cu plating, resist stripping).
Request Glass Panel Quote
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