Expert Wafer Etching Services for Next-Generation Devices
At Ginechip, we deliver industry-leading wafer etching solutions that power the semiconductor and MEMS industries. Our advanced processes enable the creation of complex microstructures with unmatched precision, repeatability, and speed.
From high-aspect-ratio DRIE trenches to delicate thin-film removal, our team of process engineers works closely with you to optimize every step — reducing development time and maximizing device performance.
With over 100 successful projects and ISO-certified facilities, we help innovators bring breakthrough technologies from concept to production faster than ever.
Why Choose Our Wafer Etching Services
Sub-Micron Precision
±0.1 μm feature control across 2"–8" wafers
Process yield guarantee
Wet + Dry Etching
KOH, BOE, Piranha, RIE & DRIE capabilities
Maximum aspect ratio
Class 100 Cleanroom
Full-scale production & prototyping facility
Maximum wafer diameter
Rapid Turnaround
48-hour prototype etching available
Projects delivered annually
The Wafer Etching Process – Our Core Service
We provide complete wafer etching solutions for semiconductor ICs, MEMS devices, and advanced microfabrication. Our capabilities combine industry-best equipment with deep process expertise to deliver superior results every time.
What is Wafer Etching?
Wafer etching is the critical semiconductor manufacturing step that selectively removes material from silicon wafers to form precise patterns, trenches, cavities, and microstructures. It enables the creation of transistors, sensors, interconnects, and 3D features used in everything from smartphones to autonomous vehicles.
- Wet Etching: Isotropic & anisotropic chemical removal (KOH, BOE, Piranha)
- Dry Etching: Plasma-based RIE & DRIE for high aspect ratio structures
Our Capabilities
• 2" to 8" (50–200 mm) wafer sizes
• Silicon, SiO₂, Si₃N₄, metals (Al, Au, Cu), polyimide & more
• Aspect ratios up to 20:1 with DRIE Bosch process
• Feature sizes down to 0.1 μm
• High uniformity < ±2% across full wafer
Facility & Equipment
State-of-the-art Class 100 cleanroom with:
- Advanced plasma etch systems (RIE & DRIE)
- Automated wet benches for KOH/BOE/Piranha
- High-precision metrology tools (SEM, profilometer, ellipsometer)
- Automated wafer handling & tracking
- Full traceability & process control software
Case Study: MEMS Gyroscope
A leading automotive sensor manufacturer needed deep silicon trenches (150 μm) with vertical sidewalls for a high-performance MEMS gyroscope. Using our optimized DRIE process, we achieved 98.7% yield and delivered 500 wafers in under 10 days — 40% faster than their previous supplier.
“Ginechip’s etching precision exceeded our specs and accelerated our product launch.” — VP Engineering, Tier-1 Automotive
What Our Customers Say
“Best-in-class DRIE results and outstanding support. They became our go-to etching partner overnight.”
— R&D Director, Photonics Startup
“Turnaround time and quality are unmatched. Saved us months in development.”
— Process Engineer, MEMS Foundry
Our Proven Wafer Etching Workflow
Consultation & Design Review
Free technical consultation. We analyze your mask design and recommend the optimal etching process.
Photolithography & Masking
Precision photoresist patterning on your wafers (or we can handle full front-end processing).
Etching Execution
Wet or dry etching using the exact chemistry and plasma conditions tailored to your specs.
Post-Etch Cleaning & Inspection
Resist strip, particle removal, and full metrology verification (CD-SEM, step height, uniformity).
Quality Assurance & Packaging
100% inspection, data reports, and secure cleanroom packaging for immediate shipping.
Why Leading Semiconductor & MEMS Companies Choose Ginechip
Key Applications of Our Wafer Etching Process
From consumer electronics to cutting-edge medical devices — our etching solutions enable breakthrough performance across industries.
Integrated Circuits
Precise transistor and interconnect patterning for CPUs, memory, and logic chips.
MEMS Accelerometers
High-aspect-ratio structures for automotive safety and smartphone motion sensing.
Gyroscopes & Inertial Sensors
Deep silicon trenches enabling navigation and stabilization systems.
Pressure Sensors
Diaphragm and cavity etching for industrial, medical, and aerospace applications.
Microfluidics & Lab-on-a-Chip
Channels and reservoirs for biotech diagnostics and drug delivery systems.
Through-Silicon Vias (TSV)
Vertical interconnects for 3D chip stacking and advanced packaging.
Photonic & Optical Devices
Waveguides and mirrors for high-speed data communication.
Solar Cells & Photovoltaics
Surface texturing and contact hole etching for higher efficiency panels.
RF & Microwave Components
High-frequency filters and resonators used in 5G and radar systems.
Ready to Launch Your Next Semiconductor Project?
Get a free process consultation and competitive quote for your wafer etching requirements today.
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