MEMS Foundry Service
Professional MEMS processing platform — enabling advanced micro-nano fabrication for research and production
Explore Our CapabilitiesYW MEMS Foundry Services
We provide a full range of MEMS foundry capabilities including lithography, thin film deposition, etching, bonding, PI/PDMS processes, TSV, mask fabrication, ion implantation, and more — supporting one-stop custom processing from design to delivery.
Fast response • High quality • Full control • 1-to-1 service
Photolithography Processing
Photolithography is a key step in semiconductor and MEMS device fabrication. It uses exposure and development to pattern photoresist, then transfers the pattern to the substrate via etching. We master electron beam lithography, laser direct writing, and UV lithography with high precision and resolution.
Learn More →Thin Film Deposition / Coating
Vacuum deposition forms dense thin films of metals or dielectrics on substrates under vacuum. Film quality is critical for device performance. We offer PVD, CVD, ALD, and sputtering processes with excellent uniformity and adhesion.
Learn More →Etching Process
Etching selectively removes material from substrate or thin films according to mask patterns. Essential in MEMS/IC/micro-nano fabrication. We provide dry etching (RIE, ICP), wet etching, and deep silicon etching (Bosch process).
Learn More →Wafer Bonding
Bonding joins clean, atomically flat wafers (homogeneous or heterogeneous) via van der Waals, molecular, or atomic forces after surface activation. We support anodic, fusion, eutectic, and adhesive bonding techniques.
Learn More →Polyimide (PI) Process
Polyimide offers excellent thermal stability, electrical insulation, adhesion, and chemical resistance. Widely used in flexible electronics and MEMS passivation. We provide spin-coating, patterning, and curing of high-quality PI films.
Learn More →PDMS Process
Polydimethylsiloxane (PDMS) is easy to process, chemically inert, optically clear, and low-cost — ideal for microfluidics. We offer mold fabrication, soft lithography, and custom PDMS device manufacturing.
Learn More →Through-Silicon Via (TSV)
TSV enables vertical interconnection in 3D integrated circuits, maximizing stacking density and reducing interconnect length. We provide via etching, insulation, filling, and planarization services.
Learn More →Photomask / Lithography Mask
Photomasks are master templates used in lithography to transfer patterns. We fabricate high-precision chrome and emulsion masks on quartz or soda-lime substrates for UV and e-beam applications.
Learn More →Ion Implantation
Ion implantation accelerates dopant ions into the target to modify electrical, physical, or chemical properties. It is the primary method for precise doping in silicon. We support various species and dose/energy ranges.
Learn More →Ready to Start Your MEMS Project?
Contact us for professional one-to-one MEMS foundry services — from prototype to volume production.
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