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Redistribution Layer (RDL) Formation
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Customized Substrate
Material Customization (dopant, thickness, orientation)
Film & Coating Customization (custom layers)
Pattern Customization (test structures, pre-patterned)
Daisy Chain Wafers (reliability / yield testing)
Dummy Die Fabrication
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SEMI-Standard Laser Marking
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Low-Yield / Scrap Dies & Wafers (test/dummy use)
Handling Tools (tweezers, vacuum wands)
Applications
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Home
Wafer Substrate
Silicon Wafers
Compound Semiconductors
Glass & Optical Substrates
Specialty & Coated Substrates
Ingots & Bulk
Other Materials
MEMS Foundry
Lithography Masks (photomasks)
Thin-Film Coating & Deposition Service
Wet & Dry Etching (incl. DRIE)
Polyimide (PI) Processing
Ion Implantation & Doping
PDMS Molding & Processing
Through-Silicon Via (TSV) Fabrication
Wafer Bonding (anodic, fusion, eutectic)
Wafer Bumping & UBM
Redistribution Layer (RDL) Formation
Service
Customized Substrate
Material Customization (dopant, thickness, orientation)
Film & Coating Customization (custom layers)
Pattern Customization (test structures, pre-patterned)
Daisy Chain Wafers (reliability / yield testing)
Dummy Die Fabrication
Wafer Reclaim (strip, polish, recycle)
Precision Wafer Cleaning
Wafer Re-sizing / Edge Grinding / Dicing
SEMI-Standard Laser Marking
Laser Drilling (vias / custom features)
Consumables & Tools
Wafer Frames & Rings
Wafer Cassettes (PEEK, ESD-safe)
Shipping Boxes & Carriers
IC / Die Boxes
Photoresists & Chemicals
Lithography Masks (photomasks)
Low-Yield / Scrap Dies & Wafers (test/dummy use)
Handling Tools (tweezers, vacuum wands)
Applications
Blog
Knowledge
News
About
Contact
Redistribution Layer (RDL) Formation
